M52221DEMO Freescale Semiconductor, M52221DEMO Datasheet - Page 30

• Manufacturer Part Number: M52221DEMO
• Description: BOARD DEMO FOR MCF52221
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: MPUr

Specifications of M52221DEMO

• Contents: SBC, Cables and Software
• Processor To Be Evaluated: MCF52221
• Data Bus Width: 32 bit
• Interface Type: RS-232, USB
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V2
• Silicon Core Number: MCF52
• Silicon Family Name: MCF5222x
• Rohs Compliant: Yes
• For Use With/related Products: MCF52221
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
2.3
Table 22
30
1
2
3
4
5
81 MAPBGA Junction to ambient, natural convection
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
100 LQFP
64 LQFP
JA
and Ψ
lists thermal resistance values.
Thermal Characteristics
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
JA
and power dissipation specifications in the system design to prevent device junction
MCF52223 ColdFire Microcontroller, Rev. 2
Table 22. Thermal Characteristics
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
—
—
—
—
—
—
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
JMA
JMA
JMA
JMA
JMA
JMA
T
T
T
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
jt
jt
j
jt
j
jt
j
parameter, the device power
Freescale Semiconductor
Value
53
39
42
33
61
35
50
31
62
43
50
36
105
105
105
25
20
12
26
9
2
2
9
2
1,2
1,3
1,3
1,3
5
6
1,2
2,3
2,3
2,3
6
1,2
1,3
1,3
1,3
5
6
4
4
5
4
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
o
o
C
C
C