PESD1LIN,115 NXP Semiconductors, PESD1LIN,115 Datasheet - Page 6

• Manufacturer Part Number: PESD1LIN,115
• Description: DIODE ESD PROTECTION SOD323
• Manufacturer: NXP Semiconductors

Specifications of PESD1LIN,115

• Package / Case: SC-76, SOD-323, UMD2
• Voltage - Reverse Standoff (typ): 15V
• Voltage - Breakdown: 17.1V
• Power (watts): 160W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Clamping Voltage: 25 V
• Operating Voltage: 24 V
• Breakdown Voltage: 18.9 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 160 W
• Capacitance: 17 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 25.4V
• Reverse Stand-off Voltage: 24V
• Leakage Current (max): 50nA
• Peak Pulse Current: 3A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4033-2; 934058897115; PESD1LIN T/R; PESD1LIN T/R

NXP Semiconductors
7. Application information
PESD1LIN_2
Product data sheet
The PESD1LIN is designed for the protection of one LIN bus signal line from the damage
caused by ESD and surge pulses. The PESD1LIN provides a surge capability of up to
160 W per line for a 8/20 s waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESD1LIN as close to the input terminal or connector as possible.
2. The path length between the PESD1LIN and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductor.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
Fig 6.
ground loops.
vias.
Typical application: ESD protection of one automotive LIN bus line
power application (e.g. electro motor, inductive loads)
application (e.g. voltage regulator and microcontroller)
Rev. 02 — 12 November 2008
transceiver
GND
BAT
LIN
LIN
C MASTER/SLAVE
C BAT
PESD1LIN
24 V
15 V
LIN bus ESD protection diode
connector
LIN node
006aaa678
PESD1LIN
© NXP B.V. 2008. All rights reserved.
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