PESD1LIN,115 NXP Semiconductors, PESD1LIN,115 Datasheet - Page 8
![DIODE ESD PROTECTION SOD323](/photos/5/25/52531/568-umd2_sod-323_sc-76_sod323_sml.jpg)
PESD1LIN,115
Manufacturer Part Number
PESD1LIN,115
Description
DIODE ESD PROTECTION SOD323
Manufacturer
NXP Semiconductors
Datasheet
1.PESD1LIN115.pdf
(11 pages)
Specifications of PESD1LIN,115
Package / Case
SC-76, SOD-323, UMD2
Voltage - Reverse Standoff (typ)
15V
Voltage - Breakdown
17.1V
Power (watts)
160W
Polarization
Bidirectional
Mounting Type
Surface Mount
Polarity
Bidirectional
Clamping Voltage
25 V
Operating Voltage
24 V
Breakdown Voltage
18.9 V
Termination Style
SMD/SMT
Peak Surge Current
3 A
Peak Pulse Power Dissipation
160 W
Capacitance
17 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Dimensions
1.35 mm W x 2.7 mm L x 1.1 mm H
Number Of Elements
1
Operating Temperature Classification
Military
Reverse Breakdown Voltage
25.4V
Reverse Stand-off Voltage
24V
Leakage Current (max)
50nA
Peak Pulse Current
3A
Test Current (it)
5mA
Operating Temp Range
-65C to 150C
Mounting
Surface Mount
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4033-2
934058897115
PESD1LIN T/R
PESD1LIN T/R
934058897115
PESD1LIN T/R
PESD1LIN T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PESD1LIN,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
10. Soldering
PESD1LIN_2
Product data sheet
Fig 8.
Fig 9.
1.65
2.75
(2 )
Reflow soldering footprint SOD323 (SC-76)
Wave soldering footprint SOD323 (SC-76)
0.95
1.2
(2 )
(2 )
0.5
0.6
Rev. 02 — 12 November 2008
1.5 (2 )
3.05
2.1
2.2
2.9
5
0.5 (2 )
0.6 (2 )
LIN bus ESD protection diode
direction during soldering
Dimensions in mm
Dimensions in mm
PESD1LIN
preferred transport
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
occupied area
solder lands
solder resist
solder paste
occupied area
sod323_fw
sod323_fr
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