PIC12F519-I/MC Microchip Technology, PIC12F519-I/MC Datasheet - Page 65

• Manufacturer Part Number: PIC12F519-I/MC
• Description: IC PIC MCU FLASH 1KX12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F519-I/MC

• Core Size: 8-Bit
• Program Memory Size: 1.5KB (1K x 12)
• Core Processor: PIC
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Ram Size: 41 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 41Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Package: 8DFN EP
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 6
• Interface Type: USB
• Number Of Timers: 1
• Processor Series: PIC12F
• Core: PIC
• Data Ram Size: 41 B
• Maximum Clock Frequency: 8 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

11.1
TABLE 11-1:
© 2008 Microchip Technology Inc.
DC CHARACTERISTICS
D001
D002
D003
D004
D005
D010
D020
D022
Note 1:
Param
No.
2:
3:
4:
5:
*
DC Characteristics
V
V
V
S
I
I
I
I
Sym.
DDP
DD
PD
WDT
DD
DR
POR
VDD
These parameters are characterized but not tested.
Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail-to-rail for external clock modes; all I/O pins tri-stated, pulled to
V
For standby current measurements, the conditions are the same as I
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
SS
, T0CKI = V
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current During Prog/
Erase.
Supply Current
Power-down Current
WDT Current
DC CHARACTERISTICS: PIC12F519 (INDUSTRIAL)
DD
DD
Start Voltage to ensure
Rise Rate to ensure
Characteristic
DD
, MCLR = V
(3,4)
DD
DD
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in active operation mode are:
DD
; WDT enabled/disabled as specified.
(2)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40°C ≤ T
0.05*
Min.
2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
250*
0.75
0.35
1.5*
Vss
175
400
250
0.1
1.0
7.0
38
—
11
(1)
Max.
16.0
250
700
400
5.5
1.2
1.2
2.2
3.0
20
54
—
—
—
—
Units
V/ms
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
V
V
V
DD
, except that the device is in Sleep
See Figure 11-1
Device in Sleep mode
See Section 8.4 “Power-on
Reset (POR)” for details
See Section 8.4 “Power-on
Reset (POR)” for details
F
F
F
F
F
F
V
V
V
V
A
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
≤ +85°C (industrial)
= 2.0V
= 5.0V
= 2.0V
= 5.0V
PIC12F519
= 4 MHz, V
= 4 MHz, V
= 8 MHz, V
= 8 MHz, V
= 32 kHz, V
= 32 kHz, V
Conditions
DS41319B-page 63
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V