PIC12F675-I/P Microchip Technology, PIC12F675-I/P Datasheet - Page 19
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PIC12F675-I/P
Manufacturer Part Number
PIC12F675-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP
Quantity:
5 000
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MCP
Quantity:
12 420
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
2.3
The Program Counter (PC) is 13-bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<12:8>) is not
directly readable or writable and comes from PCLATH.
On any Reset, the PC is cleared. Figure 2-3 shows the
two situations for the loading of the PC. The upper
example in Figure 2-3 shows how the PC is loaded on
a write to PCL (PCLATH<4:0> PCH). The lower
example in Figure 2-3 shows how the PC is loaded
during a CALL or GOTO instruction (PCLATH<4:3>
PCH).
FIGURE 2-3:
2.3.1
A computed GOTO is accomplished by adding an offset
to the PC (ADDWF PCL). When performing a table read
using a computed GOTO method, care should be
exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to the
Application Note, “Implementing a Table Read”
(AN556).
2010 Microchip Technology Inc.
PC
PC
12
12 11 10
2
PCL and PCLATH
5
PCH
PCLATH<4:3>
PCH
COMPUTED GOTO
PCLATH
PCLATH<4:0>
8
PCLATH
8
7
7
LOADING OF PC IN
DIFFERENT SITUATIONS
PCL
PCL
11
8
0
0
Instruction with
PCL as
Destination
ALU result
GOTO, CALL
Opcode <10:0>
2.3.2
The PIC12F629/675 family has an 8-level deep x 13-bit
wide hardware stack (see Figure 2-1). The stack space
is not part of either program or data space and the
Stack Pointer is not readable or writable. The PC is
PUSHed onto the stack when a CALL instruction is
executed, or an interrupt causes a branch. The stack is
POPed in the event of a RETURN, RETLW or a RETFIE
instruction execution. PCLATH is not affected by a
PUSH or POP operation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
Note 1: There are no Status bits to indicate Stack
2: There are no instructions/mnemonics
STACK
Overflow or Stack Underflow conditions.
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions, or the vectoring to an
interrupt address.
PIC12F629/675
DS41190G-page 19