PIC12F675-I/P Microchip Technology, PIC12F675-I/P Datasheet - Page 9
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F675-I/P
Manufacturer Part Number
PIC12F675-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP
Quantity:
5 000
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MCP
Quantity:
12 420
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
2.0
2.1
The PIC12F629/675 devices have a 13-bit program
counter capable of addressing an 8K x 14 program
memory space. Only the first 1K x 14 (0000h-03FFh)
for the PIC12F629/675 devices is physically imple-
mented. Accessing a location above these boundaries
will cause a wrap-around within the first 1K x 14 space.
The Reset vector is at 0000h and the interrupt vector is
at 0004h (see Figure 2-1).
FIGURE 2-1:
2010 Microchip Technology Inc.
CALL, RETURN
RETFIE, RETLW
MEMORY ORGANIZATION
Program Memory Organization
On-chip Program
Interrupt Vector
Stack Level 1
Stack Level 2
Stack Level 8
Reset Vector
PC<12:0>
Memory
PROGRAM MEMORY MAP
AND STACK FOR THE
DSTEMP/675
13
000h
0004
0005
03FFh
0400h
1FFFh
2.2
The data memory (see Figure 2-2) is partitioned into
two banks, which contain the General Purpose
Registers and the Special Function Registers. The
Special Function Registers are located in the first 32
locations of each bank. Register locations 20h-5Fh are
General Purpose Registers, implemented as static
RAM and are mapped across both banks. All other
RAM is unimplemented and returns ‘0’ when read. RP0
(STATUS<5>) is the bank select bit.
• RP0 = 0 Bank 0 is selected
• RP0 = 1 Bank 1 is selected
2.2.1
The register file is organized as 64 x 8 in the
PIC12F629/675 devices. Each register is accessed,
either directly or indirectly, through the File Select
Register FSR (see Section 2.4 “Indirect Addressing,
INDF and FSR Registers”).
Note:
Data Memory Organization
The IRP and RP1 bits STATUS<7:6> are
reserved and should always be maintained
as ‘0’s.
GENERAL PURPOSE REGISTER
FILE
PIC12F629/675
DS41190G-page 9