PIC12F675-I/P Microchip Technology, PIC12F675-I/P Datasheet - Page 44
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PIC12F675-I/P
Manufacturer Part Number
PIC12F675-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP
Quantity:
5 000
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MCP
Quantity:
12 420
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F629/675
TABLE 7-1:
7.1.5
The A/D conversion is initiated by setting the
GO/DONE bit (ADCON0<1>). When the conversion is
complete, the A/D module:
• Clears the GO/DONE bit
• Sets the ADIF flag (PIR1<6>)
• Generates an interrupt (if enabled)
If the conversion must be aborted, the GO/DONE bit
can be cleared in software. The ADRESH:ADRESL
registers will not be updated with the partially complete
A/D
ADRESH:ADRESL registers will retain the value of the
FIGURE 7-2:
DS41190G-page 44
Legend: Shaded cells are outside of recommended range.
Note 1: The A/D RC source has a typical T
Operation
16 T
32 T
64 T
A/D RC
(ADFM =
(ADFM =
2 T
4 T
8 T
A/D Clock Source (T
2: These values violate the minimum required T
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the A/D RC clock source is only recommended if the
OSC
OSC
OSC
OSC
OSC
OSC
conversion
conversion will be performed during Sleep.
STARTING A CONVERSION
0
1
)
)
T
ADCS2:ADCS0
AD
MSB
10-BIT A/D RESULT FORMAT
Bit 7
Bit 7
vs. DEVICE OPERATING FREQUENCIES
000
100
001
101
010
110
x11
sample.
Unimplemented: Read as ‘
AD
)
Instead,
ADRESH
2 - 6 s
100 ns
200 ns
400 ns
800 ns
20 MHz
1.6 s
3.2 s
10-bit A/D Result
AD
(1,4)
time of 4 s for V
(2)
(2)
(2)
(2)
0’
the
MSB
AD
time.
Bit 0
Bit 0
2 - 6 s
12.8 s
400 ns
800 ns
previous conversion. After an aborted conversion, a
2 T
be initiated. Following the delay, an input acquisition is
automatically started on the selected channel.
7.1.6
The A/D conversion can be supplied in two formats: left
or right shifted. The ADFM bit (ADCON0<7>) controls
the output format. Figure 7-2 shows the output formats.
5 MHz
1.6 s
3.2 s
6.4 s
DD
Note:
AD
Device Frequency
> 3.0V.
(1,4)
(2)
(2)
(3)
delay is required before another acquisition can
Bit 7
Bit 7
The GO/DONE bit should not be set in the
same instruction that turns on the A/D.
CONVERSION OUTPUT
10-bit A/D Result
LSB
2 - 6 s
16.0 s
500 ns
1.0 s
8.0 s
4 MHz
2.0 s
4.0 s
Unimplemented: Read as ‘
2010 Microchip Technology Inc.
ADRESL
(2)
(3)
(1,4)
(2)
(3)
2 - 6 s
1.25 MHz
12.8 s
25.6 s
51.2 s
1.6 s
3.2 s
6.4 s
0
Bit 0
Bit 0
LSB
(1,4)
’
(3)
(3)
(3)