PIC12F675-I/P Microchip Technology, PIC12F675-I/P Datasheet - Page 56
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PIC12F675-I/P
Manufacturer Part Number
PIC12F675-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP
Quantity:
5 000
Company:
Part Number:
PIC12F675-I/P
Manufacturer:
MCP
Quantity:
12 420
Part Number:
PIC12F675-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F629/675
9.2.3
For applications where a clock is already available
elsewhere, users may directly drive the PIC12F629/
675 provided that this external clock source meets the
AC/DC timing requirements listed in Section 12.0
“Electrical Specifications”. Figure 9-2 shows how
an external clock circuit should be configured.
9.2.4
For applications where precise timing is not a
requirement, the RC oscillator option is available. The
operation and functionality of the RC oscillator is
dependent upon a number of variables. The RC
oscillator frequency is a function of:
• Supply voltage
• Resistor (R
• Operating temperature.
The oscillator frequency will vary from unit to unit due
to normal process parameter variation. The difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
C
tolerance of the external R and C components.
Figure 9-3 shows how the R/C combination is
connected.
Two options are available for this Oscillator mode
which allow GP4 to be used as a general purpose I/O
or to output F
FIGURE 9-3:
DS41190G-page 56
C
EXT
V
R
EXT
SS
EXT
F
values. The user also needs to account for the
V
OSC
DD
/4
EXTERNAL CLOCK IN
RC OSCILLATOR
OSC
EXT
GP5/OSC1/
CLKIN
GP4/OSC2/CLKOUT
) and capacitor (C
/4.
RC OSCILLATOR MODE
PIC12F629/675
EXT
) values
Internal
Clock
9.2.5
When calibrated, the internal oscillator provides a fixed
4 MHz (nominal) system clock. See Electrical
Specifications, Section 12.0 “Electrical Specifica-
tions”, for information on variation over voltage and
temperature.
Two options are available for this Oscillator mode
which allow GP4 to be used as a general purpose I/O
or to output F
9.2.5.1
A calibration instruction is programmed into the last
location of program memory. This instruction is a
RETLW XX, where the literal is the calibration value.
The literal is placed in the OSCCAL register to set the
calibration of the internal oscillator. Example 9-1
demonstrates how to calibrate the internal oscillator.
For best operation, decouple (with capacitance) V
and V
EXAMPLE 9-1:
9.2.6
The PIC12F629/675 devices can be configured to
provide a clock out signal in the INTOSC and RC
oscillator modes. When configured, the oscillator
frequency divided by four (F
GP4/OSC2/CLKOUT pin. F
purposes or to synchronize other logic.
Note:
BSF
CALL
MOVWF
BCF
SS
as close to the device as possible.
Erasing the device will also erase the pre-
programmed internal calibration value for
the internal oscillator. The calibration value
must be saved prior to erasing part as
specified in the PIC12F629/675 Program-
ming specification. Microchip Develop-
ment Tools maintain all Calibration bits to
factory settings.
INTERNAL 4 MH
CLKOUT
STATUS, RP0
3FFh
OSCCAL
STATUS, RP0
OSC
Calibrating the Internal Oscillator
/4.
CALIBRATING THE
INTERNAL OSCILLATOR
2010 Microchip Technology Inc.
OSC
OSC
;Bank 1
;Get the cal value
;Calibrate
;Bank 0
Z
/4 can be used for test
OSCILLATOR
/4) is output on the
DD