PIC16F74-I/P Microchip Technology, PIC16F74-I/P Datasheet - Page 121

• Manufacturer Part Number: PIC16F74-I/P
• Description: IC MCU FLASH 4KX14 A/D 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F74-I/P

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 33
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 33
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 33
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx8-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 192 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 444-1001 - DEMO BOARD FOR PICMICRO MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

15.0
Absolute Maximum Ratings †
Ambient temperature under bias................................................................................................................ .-55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Voltage on RA4 with respect to Vss ...................................................................................................................0 to +12V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA, PORTB, and PORTE (combined) (Note 3) ...................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (combined) (Note 3)..............................................200 mA
Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................200 mA
 2002 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: Pdis = V
2: Voltage spikes at the MCLR pin may cause latchup. A series resistor of greater than 1 kΩ should be used
3: PORTD and PORTE are not implemented on the PIC16F73/76 devices.
ELECTRICAL CHARACTERISTICS
to pull MCLR to V
DD
with respect to V
IK
OK
(V
DD
SS
I
(V
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
DD
< 0 or V
, rather than tying the pin directly to V
SS
I
SS
SS
> V
............................................................................................................ -0.3 to +6.5V
(Note 2) ..............................................................................................0 to +13.5V
O
(except V
DD
> V
)..................................................................................................................... ± 20 mA
DD
) ............................................................................................................. ± 20 mA
DD
, MCLR. and RA4) ......................................... -0.3V to (V
DD
x {I
DD
DD
- ∑ I
.
OH
} + ∑ {(V
DD
- V
PIC16F7X
OH
) x I
DS30325B-page 119
OH
} + ∑(V
DD
O
+ 0.3V)
l x I
OL
)