PIC16F74-I/P Microchip Technology, PIC16F74-I/P Datasheet - Page 93

• Manufacturer Part Number: PIC16F74-I/P
• Description: IC MCU FLASH 4KX14 A/D 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F74-I/P

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 33
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 33
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 33
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx8-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 192 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 444-1001 - DEMO BOARD FOR PICMICRO MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

12.2
12.2.1
The PIC16F7X can be operated in four different oscil-
lator modes. The user can program two configuration
bits (FOSC1 and FOSC0) to select one of these four
modes:
• LP
• XT
• HS
• RC
12.2.2
In XT, LP or HS modes, a crystal or ceramic resonator is
connected to the OSC1/CLKIN and OSC2/CLKOUT
pins
PIC16F7X oscillator design requires the use of a parallel
cut crystal. Use of a series cut crystal may give a fre-
quency out of the crystal manufacturers specifications.
When in HS mode, the device can accept an external
clock source to drive the OSC1/CLKIN pin (Figure 12-2).
See Figure 15-1 or Figure 15-2 (depending on the part
number and V
frequencies.
FIGURE 12-1:
 2002 Microchip Technology Inc.
Note 1: See Table 12-1 and Table 12-2 for recom-
to
C1
C2
2: A series resistor (RS) may be required for AT
3: RF varies with the crystal chosen.
Oscillator Configurations
(1)
(1)
establish
Low Power Crystal
Crystal/Resonator
High Speed Crystal/Resonator
Resistor/Capacitor
CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
mended values of C1 and C2.
strip cut crystals.
OSCILLATOR TYPES
XTAL
RS
DD
(2)
OSC1
OSC2
range) for valid external clock
oscillation
CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP
OSC CONFIGURATION)
RF
(3)
(Figure 12-1).
PIC16F7X
SLEEP
To
Internal
Logic
The
FIGURE 12-2:
TABLE 12-1:
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values were not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes at the bottom of page 92 for additional
information.
16.0 MHz
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
DD
Clock from
Ext. System
Mode
HS
XT
and temperature range for the application.
Typical Capacitor Values Used:
16.0 MHz
Open
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
Freq
Resonators Used:
CERAMIC RESONATORS
(FOR DESIGN GUIDANCE
ONLY)
Panasonic EFO-A455K04B
Murata Erie CSA16.00MX
Murata Erie CSA2.00MG
Murata Erie CSA4.00MG
Murata Erie CSA8.00MT
EXTERNAL CLOCK INPUT
OPERATION (HS OSC
CONFIGURATION)
OSC1
OSC2
PIC16F7X
OSC1
56 pF
47 pF
33 pF
27 pF
22 pF
PIC16F7X
(HS Mode)
DS30325B-page 91
OSC2
56 pF
47 pF
33 pF
27 pF
22 pF