PIC18F2455-I/SP Microchip Technology, PIC18F2455-I/SP Datasheet - Page 4
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PIC18F2455-I/SP
Manufacturer Part Number
PIC18F2455-I/SP
Description
IC PIC MCU FLASH 12KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
7.PIC18F2455-ISO.pdf
(426 pages)
8.PIC18LF2455-ISO.pdf
(430 pages)
Specifications of PIC18F2455-I/SP
Program Memory Type
FLASH
Program Memory Size
24KB (12K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI/I2C/EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2455-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F2455/2550/4455/4550
Silicon Errata Issues
1. Module: EUSART
2. Module: Timer1/3
DS80478A-page 4
Note:
When performing back-to-back transmission in
9-bit mode (TX9D bit in the TXSTA register is
set), an ongoing transmission’s timing can be
corrupted if the TX9D bit (for the next transmis-
sion) is not written immediately following the
setting of TXIF. This is because any write to the
TXSTA register results in a reset of the Baud
Rate Generator which will effect any ongoing
transmission.
Work around
Load TX9D just after TXIF is set, either by polling
TXIF or by writing TX9D at the beginning of the
Interrupt Service Routine, or only write to TX9D
when a transmission is not in progress
(TRMT = 1).
Affected Silicon Revisions
When Timer1/3 is operating in 16-bit mode and
the prescale setting is not 1:1, a write to the
TMR1H/TMR3H Buffer registers may lengthen
the duration of the period between the incre-
ments of the timer for the period in which
TMR1H/TMR3H were written.
Work around
Either of two work arounds can be used:
• Stop Timer1/Timer3 before writing the
• Write TMR1L/TMR3L immediately after
Affected Silicon Revisions
TMR1H/TMR3H registers
writing TMR1H/TMR3H
A3
A3
X
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (B7).
B4
B4
B5
B5
B6
B6
B7
B7
3. Module: MSSP
In Slave Transmit mode, when a transmission is
initiated, the SSPBUF register may be written for
up to 10 T
The data transfer may be corrupted if SSPBUF is
written during this time.
The WCOL bit is set any time an SSPBUF write
occurs during a transfer.
Work around
Avoid writing SSPBUF until the data transfer is
complete, indicated by the setting of the SSPIF bit
(PIR1<3>).
To ensure any potential transfer in progress is not
corrupted,
(SSPCON1<7>) is clear after writing SSPBUF.
Affected Silicon Revisions
A3
X
CY
before additional writes are blocked.
B4
verify
© 2009 Microchip Technology Inc.
that
B5
the
B6
WCOL
B7
bit