DSPIC30F6013A-30I/PF Microchip Technology, DSPIC30F6013A-30I/PF Datasheet - Page 42

no-image

DSPIC30F6013A-30I/PF

Manufacturer Part Number
DSPIC30F6013A-30I/PF
Description
IC DSPIC MCU/DSP 132K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6013A-30I/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
132KB
Supply Voltage Range
2.5V To 5.5V
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6013A-30I/PF
Manufacturer:
Microchip
Quantity:
339
Part Number:
DSPIC30F6013A-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6013A-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6011A/6012A/6013A/6014A
4.1.3
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
Addressing
instructions, move and accumulator instructions also
support
Addressing mode, also referred to as Register Indexed
mode.
In summary, the following Addressing modes are
supported by move and accumulator instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-modified
• Register Indirect Pre-modified
• Register Indirect with Register Offset (Indexed)
• Register Indirect with Literal Offset
• 8-bit Literal
• 16-bit Literal
4.1.4
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
Addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The 2 source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will always be directed to the
Y AGU. The effective addresses generated (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
DS70143D-page 42
Note:
Note:
Note:
Register
MOVE AND ACCUMULATOR
INSTRUCTIONS
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (register offset)
field is shared between both source and
destination (but typically only used by
one).
Not all instructions support all the
Addressing modes given above. Individual
instructions may support different subsets
of these Addressing modes.
MAC INSTRUCTIONS
Register indirect with register offset
addressing is only available for W9 (in X
space) and W11 (in Y space).
modes
Indirect
supported
with
by
Register
most
Offset
MCU
In summary, the following Addressing modes are
supported by the MAC class of instructions:
• Register Indirect
• Register Indirect Post-modified by 2
• Register Indirect Post-modified by 4
• Register Indirect Post-modified by 6
• Register Indirect with Register Offset (Indexed)
4.1.5
Besides the various Addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can
be supported in each of the X (which also provides the
pointers into program space) and Y data spaces.
Modulo Addressing can operate on any W register
pointer. However, it is not advisable to use W14 or W15
for Modulo Addressing since these two registers are
used as the Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain restrictions on the buffer start address (for incre-
menting buffers), or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a Bidirectional mode (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
Modulo Addressing
OTHER INSTRUCTIONS
© 2008 Microchip Technology Inc.

Related parts for DSPIC30F6013A-30I/PF