PIC12F519-I/P Microchip Technology, PIC12F519-I/P Datasheet - Page 81

• Manufacturer Part Number: PIC12F519-I/P
• Description: IC PIC MCU FLASH 1KX12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F519-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 41 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 41 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• Package: 8PDIP
• Device Core: PIC
• Family Name: PIC12
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14AC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
Preliminary
NOTE 2
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
MIN
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
PIC12F519
N
MAX
1.00
0.05
0.50
1.75
1.90
0.30
–
E2
NOTE 1
DS41319A-page 79