PIC32MX675F512L-80I/PF Microchip Technology, PIC32MX675F512L-80I/PF Datasheet - Page 178
![IC MCU 32BIT 512KB FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC32MX675F512L-80I/PF
Manufacturer Part Number
PIC32MX675F512L-80I/PF
Description
IC MCU 32BIT 512KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.PIC32MX320F032H-40IPT.pdf
(66 pages)
2.PIC32MX575F256H-80IMR.pdf
(2 pages)
3.PIC32MX575F256H-80IMR.pdf
(254 pages)
4.PIC32MX575F256H-80IMR.pdf
(14 pages)
5.PIC32MX575F256H-80IPT.pdf
(240 pages)
Specifications of PIC32MX675F512L-80I/PF
Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Controller Family/series
PIC32
Ram Memory Size
64KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
I2C, SPI, UART, USB
No. Of Pwm Channels
5
Embedded Interface Type
I2C, SPI, UART, USB
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX675F512L-80I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC32MX320F032H-40IPT PDF datasheet
- PIC32MX575F256H-80IMR PDF datasheet #2
- PIC32MX575F256H-80IMR PDF datasheet #3
- PIC32MX575F256H-80IMR PDF datasheet #4
- PIC32MX575F256H-80IPT PDF datasheet #5
- Current page: 178 of 240
- Download datasheet (3Mb)
PIC32MX5XX/6XX/7XX
31.1
TABLE 31-1:
TABLE 31-2:
TABLE 31-3:
TABLE 31-4:
DS61156B-page 178
DC5
Note 1:
PIC32MX5XX/6XX/7XX
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 121-Pin XBGA (10x10x1.1 mm)
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-Pin QFN (9x9x0,9 mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
Param.
No.
Operating Junction Temperature Range
DC Characteristics
P
I/O = S ({V
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
40 MHz maximum for PIC32MX 40 MHz family variants.
Junction to ambient thermal resistance, Theta-
This is the limit to which V
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention Voltage
(Note 1)
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
DD
x (I
DD
DD
– V
V
DD
(in Volts)
Start Voltage
Rise Rate
DD
2.3-3.6V
Characteristics
OH
– S I
Characteristics
Range
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
Preliminary
-40°C to +85°C
))
Temp. Range
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
0.00005
(in °C)
Min.
1.75
1.75
2.3
JA
(
JA
) numbers are achieved by package simulations.
Typical
—
—
—
—
Symbol
Symbol Typical
P
DMAX
P
T
T
JA
JA
JA
JA
JA
A
D
J
0.115
Max.
1.95
3.6
—
-40°C T
Min.
-40
-40
40
43
43
47
28
PIC32MX5XX/6XX/7XX
Units
V/ s
(T
V
V
V
2009 Microchip Technology Inc.
P
Max. Frequency
80 MHz (Note 1)
A
J
INT
Typical
– T
Max.
+85°C for Industrial
—
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1
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