PIC32MX675F512L-80I/PF Microchip Technology, PIC32MX675F512L-80I/PF Datasheet - Page 235
![IC MCU 32BIT 512KB FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC32MX675F512L-80I/PF
Manufacturer Part Number
PIC32MX675F512L-80I/PF
Description
IC MCU 32BIT 512KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.PIC32MX320F032H-40IPT.pdf
(66 pages)
2.PIC32MX575F256H-80IMR.pdf
(2 pages)
3.PIC32MX575F256H-80IMR.pdf
(254 pages)
4.PIC32MX575F256H-80IMR.pdf
(14 pages)
5.PIC32MX575F256H-80IPT.pdf
(240 pages)
Specifications of PIC32MX675F512L-80I/PF
Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Controller Family/series
PIC32
Ram Memory Size
64KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
I2C, SPI, UART, USB
No. Of Pwm Channels
5
Embedded Interface Type
I2C, SPI, UART, USB
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX675F512L-80I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC32MX320F032H-40IPT PDF datasheet
- PIC32MX575F256H-80IMR PDF datasheet #2
- PIC32MX575F256H-80IMR PDF datasheet #3
- PIC32MX575F256H-80IMR PDF datasheet #4
- PIC32MX575F256H-80IPT PDF datasheet #5
- Current page: 235 of 240
- Download datasheet (3Mb)
TABLE B-1:
2009 Microchip Technology Inc.
Section 12.0 “I/O Ports”
Section 22.0 “10-bit Analog-to-
Digital Converter (ADC)”
Section 28.0 “Special Features”
Section 31.0 “Electrical
Characteristics”
Section 32.0 “Packaging
Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the second paragraph of Section 12.1.2 “Digital Inputs” and
removed Table 12-1.
Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).
Removed references to the ENVREG pin in Section 28.3 “On-Chip Voltage
Regulator” .
Updated the first sentence of Section 28.3.1 “On-Chip Regulator and
POR” and Section 28.3.2 “On-Chip Regulator and BOR” .
Updated the Connections for the On-Chip Regulator (see Figure 28-2).
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 31-3).
Updated the Operating Current (I
Updated the Idle Current (I
Updated the Power-Down Current (I
Removed Note 1 from the Program Flash Memory Wait State Characteristics
(see Table 31-11).
Updated the SPIx Module Slave Mode (CKE = 1 ) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 31-13).
Added the 121-pin XBGA package marking information and package details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Preliminary
PIC32MX5XX/6XX/7XX
IDLE
Update Description
) DC Characteristics (see Table 31-6).
DD
) DC Characteristics (see Table 31-5).
PD
) DC Characteristics (see Table 31-7).
DS61156B-page 235
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