ST10R167-Q3 STMicroelectronics, ST10R167-Q3 Datasheet - Page 12

IC MCU 16BIT ROMLESS 144-PQFP

ST10R167-Q3

Manufacturer Part Number
ST10R167-Q3
Description
IC MCU 16BIT ROMLESS 144-PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of ST10R167-Q3

Core Processor
ST10
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-QFP
Processor Series
ST10R1x
Core
ST10
Data Bus Width
16 bit
Program Memory Size
32 KB
Data Ram Size
4 KB
Interface Type
CAN/SSC/USART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
111
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-2043

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST10R167-Q3
Manufacturer:
ST
Quantity:
556
Part Number:
ST10R167-Q3
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST10R167-Q3
Manufacturer:
ST
0
Part Number:
ST10R167-Q3
Manufacturer:
ST
Quantity:
20 000
Part Number:
ST10R167-Q3/TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST10R167-Q3/TR
Manufacturer:
ST
0
Part Number:
ST10R167-Q3B0
Manufacturer:
ST
Quantity:
1 343
Part Number:
ST10R167-Q3B0
Manufacturer:
ST
0
Part Number:
ST10R167-Q3B0
Manufacturer:
ST
Quantity:
20 000
ST10R167
V - CENTRAL PROCESSING UNIT (CPU)
The CPU includes a 4-stage instruction pipeline, a
16-bit arithmetic and logic unit (ALU) and dedi-
cated SFRs. Additional hardware has been added
for a separate multiply and divide unit, a bit-mask
generator and a barrel shifter.
Most of the ST10R167’s instructions can be exe-
cuted in one instruction cycle which requires 80ns
at 25MHz CPU clock. For example, shift and
rotate instructions are processed in one instruc-
tion cycle independent of the number of bits to be
shifted. Multiple-cycle instructions have been opti-
mized: branches are carried out in 2 cycles, 16 x
16 bit multiplication in 5 cycles and a 32/16 bit
division in 10 cycles.The jump cache reduces the
execution time of repeatedly performed jumps in a
loop, from 2 cycles to 1 cycle.
Figure 4 : CPU Block Diagram
12/63
External
Memory
32
Exec. Unit
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
Data Pg. Ptrs
Instr. Ptr
Instr. Reg
STKUN
SYSCON
STKOV
PSW
4-Stage
Pipeline
SP
ADDRSEL 1
ADDRSEL 2
ADDRSEL 3
ADDRSEL 4
Code Seg. Ptr.
Bit-Mask Gen.
Mul./Div.-HW
Barrel-Shift
CPU
16-Bit
MDH
MLD
ALU
CP
The CPU uses an actual register context
consisting of up to 16 Word wide GPRs physically
allocated within the on-chip RAM area. A Context
Pointer (CP) register determines the base
address of the active register bank to be accessed
by the CPU. The number of register banks is only
restricted by the available internal RAM space.
For easy parameter passing, a register bank may
overlap others.
A system stack of up to 1024 Byte is provided as a
storage for temporary data. The system stack is
allocated in the on-chip RAM area, and it is
accessed by the CPU via the stack pointer (SP)
register. Two separate SFRs, STKOV and
STKUN, are implicitly compared against the stack
pointer value upon each stack access for the
detection of a stack overflow or underflow.
Registers
General
Purpose
R15
R0
16
16
2K Byte
Internal
RAM
Bank
Bank
Bank
n
0
i

Related parts for ST10R167-Q3