MC9S08GT16ACFDE Freescale Semiconductor, MC9S08GT16ACFDE Datasheet - Page 128
![IC MCU 16K FLASH 2K RAM 48-QFN](/photos/12/16/121644/mc9s08gt16a_sml.jpg)
MC9S08GT16ACFDE
Manufacturer Part Number
MC9S08GT16ACFDE
Description
IC MCU 16K FLASH 2K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08GT8ACFBER.pdf
(300 pages)
Specifications of MC9S08GT16ACFDE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
39
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Processor Series
S08GT
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
39
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
M68EVB908GB60E, M68DEMO908GB60E
Minimum Operating Temperature
- 40 C
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
- Current page: 128 of 300
- Download datasheet (2Mb)
Internal Clock Generator (S08ICGV4)
9.1.2
This is a high-level description only. Detailed descriptions of operating modes are contained in
Section 9.4, “Functional
128
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Digitally-controlled oscillator (DCO) preserves previous frequency settings, allowing fast
frequency lock when recovering from stop3 mode
DCO will maintain operating frequency during a loss or removal of reference clock
Post-FLL divider selects 1 of 8 bus rate divisors (/1 through /128)
Separate self-clocked source for real-time interrupt
Trimmable internal clock source supports SCI communications without additional external
components
Automatic FLL engagement after lock is acquired
External oscillator selectable for low power or high gain
Mode 1 — Off
The output clock, ICGOUT, is static. This mode may be entered when the STOP instruction is
executed.
Mode 2 — Self-clocked (SCM)
Default mode of operation that is entered immediately after reset. The ICG’s FLL is open loop and
the digitally controlled oscillator (DCO) is free running at a frequency set by the filter bits.
In this mode, the ICG’s FLL is used to create frequencies that are programmable multiples of the
internal reference clock.
— FLL engaged internal unlocked is a transition state that occurs while the FLL is attempting to
— FLL engaged internal locked is a state that occurs when the FLL detects that the DCO is locked
Mode 4 — FLL bypassed external (FBE)
In this mode, the ICG is configured to bypass the FLL and use an external clock as the clock source.
Mode 5 — FLL engaged external (FEE)
The ICG’s FLL is used to generate frequencies that are programmable multiples of the external
clock reference.
— FLL engaged external unlocked is a transition state that occurs while the FLL is attempting to
— FLL engaged external locked is a state which occurs when the FLL detects that the DCO is
Mode 3 — FLL engaged internal (FEI)
Modes of Operation
lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the
target frequency.
to a multiple of the internal reference.
lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the
target frequency.
locked to a multiple of the internal reference.
Description.”
MC9S08GT16A/GT8A Data Sheet, Rev. 1
Freescale Semiconductor
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