C8051F705-GM Silicon Laboratories Inc, C8051F705-GM Datasheet - Page 11

• Manufacturer Part Number: C8051F705-GM
• Description: IC 8051 MCU 15K FLASH 48-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F70xr

Specifications of C8051F705-GM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 15KB (15K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 32 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: C8051F7x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F700DK
• Minimum Operating Temperature: - 40 C
• Height: 0.95 mm
• Length: 7 mm
• Supply Voltage (max): 1.9 V, 3.6 V
• Supply Voltage (min): 1.7 V, 1.8 V
• Width: 7 mm
• For Use With: 336-1635 - DEV KIT FOR C8051F700
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1612-5

C8051F70x/71x
List of Tables
Table 2.1. Product Selection Guide ......................................................................... 27
Table 3.1. Pin Definitions for the C8051F70x/71x ................................................... 28
Table 4.1. TQFP-64 Package Dimensions .............................................................. 37
Table 4.2. TQFP-64 PCB Land Pattern Dimensions ............................................... 38
Table 5.1. TQFP-48 Package Dimensions .............................................................. 39
Table 5.2. TQFP-48 PCB Land Pattern Dimensions ............................................... 40
Table 6.1. QFN-48 Package Dimensions ................................................................ 41
Table 6.2. QFN-48 PCB Land Pattern Dimensions ................................................. 42
Table 7.1. QFN-32 Package Dimensions ................................................................ 43
Table 7.2. QFN-32 PCB Land Pattern Dimensions ................................................. 44
Table 8.1. QFN-24 Package Dimensions ................................................................ 45
Table 8.2. QFN-24 PCB Land Pattern Dimensions ................................................. 46
Table 9.1. Absolute Maximum Ratings .................................................................... 47
Table 9.2. Global Electrical Characteristics ............................................................. 48
Table 9.3. Port I/O DC Electrical Characteristics ..................................................... 49
Table 9.4. Reset Electrical Characteristics .............................................................. 49
Table 9.5. Internal Voltage Regulator Electrical Characteristics ............................. 50
Table 9.6. Flash Electrical Characteristics .............................................................. 50
Table 9.7. Internal High-Frequency Oscillator Electrical Characteristics ................. 50
Table 9.8. Capacitive Sense Electrical Characteristics ........................................... 51
Table 9.9. EEPROM Electrical Characteristics ........................................................ 52
Table 9.10. ADC0 Electrical Characteristics ............................................................ 52
Table 9.11. Power Management Electrical Characteristics ..................................... 53
Table 9.12. Temperature Sensor Electrical Characteristics .................................... 53
Table 9.13. Voltage Reference Electrical Characteristics ....................................... 53
Table 9.14. Comparator Electrical Characteristics .................................................. 54
Table 15.1. Gain Setting vs. Maximum Capacitance and Conversion Time ........... 81
Table 15.2. Operation with Auto-scan and Accumulate .......................................... 85
Table 16.1. CIP-51 Instruction Set Summary ........................................................ 100
Table 18.1. AC Parameters for External Memory Interface ................................... 126
Table 18.2. EMIF Pinout (C8051F700/1/2/3/8/9 and C8051F710/1) ..................... 127
Table 20.1. Special Function Register (SFR) Memory Map .................................. 131
Table 20.2. Special Function Registers ................................................................. 132
Table 21.1. Interrupt Summary .............................................................................. 139
Table 22.1. Flash Security Summary .................................................................... 150
Table 28.1. Port I/O Assignment for Analog Functions ......................................... 183
Table 28.2. Port I/O Assignment for Digital Functions ........................................... 184
Table 28.3. Port I/O Assignment for External Event Trigger Functions ................. 184
Table 29.1. Example 16-bit CRC Outputs ............................................................. 212
Table 29.2. Example 32-bit CRC Outputs ............................................................. 213
Table 30.1. SMBus Clock Source Selection .......................................................... 223
Table 30.2. Minimum SDA Setup and Hold Times ................................................ 224
Table 30.3. Sources for Hardware Changes to SMB0CN ..................................... 228
Rev. 1.0
11