PIC16F627A-I/SS Microchip Technology, PIC16F627A-I/SS Datasheet - Page 15
![IC MCU FLASH 1KX14 EEPROM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F627A-I/SS
Manufacturer Part Number
PIC16F627A-I/SS
Description
IC MCU FLASH 1KX14 EEPROM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F627A-IP.pdf
(180 pages)
3.PIC16F627A-IP.pdf
(8 pages)
4.PIC16F627A-IP.pdf
(22 pages)
5.PIC16F627A-ISO.pdf
(168 pages)
6.PIC16F648A-ISS.pdf
(178 pages)
Specifications of PIC16F627A-I/SS
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Package
20SSOP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPI3DBF648 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC162053 - HEADER INTERFACE ICD,ICD2 18DIPAC164018 - MODULE SKT PROMATEII 20SSOP
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F627A-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
3.1
The clock input (OSC1/CLKIN/RA7 pin) is internally
divided by four to generate four non-overlapping
quadrature clocks namely Q1, Q2, Q3 and Q4. Inter-
nally, the program counter (PC) is incremented every
Q1, the instruction is fetched from the program memory
and latched into the instruction register in Q4. The
instruction is decoded and executed during the
following Q1 through Q4. The clocks and instruction
execution flow is shown in Figure 3-2.
FIGURE 3-2:
EXAMPLE 3-1:
2004 Microchip Technology Inc.
1. MOVLW 55h
2. MOVWF PORTB
3. CALL
4. BSF
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction
is “flushed” from the pipeline while the new instruction is being fetched and then executed.
Clocking Scheme/Instruction
Cycle
SUB_1
PORTA, 3
CLKOUT
OSC1
Q1
Q2
Q3
PC
Q4
CLOCK/INSTRUCTION CYCLE
INSTRUCTION PIPELINE FLOW
Q1
Execute INST (PC-1)
Fetch INST (PC)
Fetch 1
Q2
PC
Q3
Execute 1
Fetch 2
Q4
Preliminary
Q1
PIC16F627A/628A/648A
Execute 2
Execute INST (PC)
Fetch INST (PC+1)
Fetch 3
Q2
PC+1
3.2
An instruction cycle consists of four Q cycles (Q1, Q2,
Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the program counter to change (e.g., GOTO)
then two cycles are required to complete the instruction
(Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3, and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
Q3
Execute 3
Fetch 4
Instruction Flow/Pipelining
Q4
Q1
Fetch SUB_1 Execute SUB_1
Execute INST (PC+1)
Fetch INST (PC+2)
Flush
Q2
PC+2
Q3
DS40044B-page 13
Q4
Internal
phase
clock