PIC16F627A-I/SS Microchip Technology, PIC16F627A-I/SS Datasheet - Page 152
![IC MCU FLASH 1KX14 EEPROM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F627A-I/SS
Manufacturer Part Number
PIC16F627A-I/SS
Description
IC MCU FLASH 1KX14 EEPROM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F627A-IP.pdf
(180 pages)
3.PIC16F627A-IP.pdf
(8 pages)
4.PIC16F627A-IP.pdf
(22 pages)
5.PIC16F627A-ISO.pdf
(168 pages)
6.PIC16F648A-ISS.pdf
(178 pages)
Specifications of PIC16F627A-I/SS
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Package
20SSOP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPI3DBF648 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC162053 - HEADER INTERFACE ICD,ICD2 18DIPAC164018 - MODULE SKT PROMATEII 20SSOP
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F627A-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F627A/628A/648A
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40044B-page 150
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
A1
A
Preliminary
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
2004 Microchip Technology Inc.
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15