PIC18F45J10-E/P Microchip Technology, PIC18F45J10-E/P Datasheet - Page 180
![IC PIC MCU FLASH 16KX16 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F45J10-E/P
Manufacturer Part Number
PIC18F45J10-E/P
Description
IC PIC MCU FLASH 16KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18LF24J10-ISS.pdf
(32 pages)
Specifications of PIC18F45J10-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180013 - MODULE PLUG-IN 18F45J10 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164329 - MODULE SKT FOR 40DIP 18F45J10
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC18F24J10-ISO PDF datasheet #2
- PIC18F24J10-ISO PDF datasheet #3
- PIC18F24J10-ISO PDF datasheet #4
- PIC18F24J10-ISO PDF datasheet #5
- PIC18LF24J10-ISS PDF datasheet #6
- Current page: 180 of 368
- Download datasheet (6Mb)
PIC18F45J10 FAMILY
16.4.7
In I
reload value is placed in the lower 7 bits of the
SSPxADD register (Figure 16-17). When a write
occurs to SSPxBUF, the Baud Rate Generator will
automatically begin counting. The BRG counts down to
‘0’ and stops until another reload has taken place. The
BRG count is decremented twice per instruction cycle
(T
BRG is reloaded automatically.
Once the given operation is complete (i.e., transmis-
sion of the last data bit is followed by ACK), the internal
clock will automatically stop counting and the SCLx pin
will remain in its last state.
FIGURE 16-17:
TABLE 16-3:
DS39682E-page 178
Note 1:
CY
2
C Master mode, the Baud Rate Generator (BRG)
) on the Q2 and Q4 clocks. In I
10 MHz
10 MHz
10 MHz
4 MHz
4 MHz
4 MHz
1 MHz
1 MHz
1 MHz
The I
100 kHz) in all details, but may be used with care where higher rates are required by the application.
BAUD RATE
F
CY
2
C™ interface does not conform to the 400 kHz I
I
2
C™ CLOCK RATE w/BRG
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPM<3:0>
SCLx
2
C Master mode, the
20 MHz
20 MHz
20 MHz
F
8 MHz
8 MHz
8 MHz
2 MHz
2 MHz
2 MHz
CY
SSPM<3:0>
* 2
Control
Reload
CLKO
Reload
Table 16-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPxADD.
16.4.7.1
Because MSSP1 and MSSP2 are independent, they
can operate simultaneously in I
different baud rates. This is done by using different
BRG reload values for each module.
Because this mode derives its basic clock source from
the system clock, any changes to the clock will affect
both modules in the same proportion. It may be pos-
sible to change one or both baud rates back to a
previous value by changing the BRG reload value.
BRG Down Counter
2
SSPxADD<6:0>
C specification (which applies to rates greater than
BRG Value
0Ch
18h
1Fh
63h
09h
27h
02h
09h
00h
Baud Rate and Module
Interdependence
© 2009 Microchip Technology Inc.
F
OSC
(2 Rollovers of BRG)
/4
2
400 kHz
400 kHz
333 kHz
C Master mode at
312.5 kHz
1 MHz
100 kHz
308 kHz
100 kHz
100 kHz
F
SCL
(1)
(1)
(1)
(1)
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