PIC18F45J10-E/P Microchip Technology, PIC18F45J10-E/P Datasheet - Page 225
![IC PIC MCU FLASH 16KX16 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F45J10-E/P
Manufacturer Part Number
PIC18F45J10-E/P
Description
IC PIC MCU FLASH 16KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18LF24J10-ISS.pdf
(32 pages)
Specifications of PIC18F45J10-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180013 - MODULE PLUG-IN 18F45J10 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164329 - MODULE SKT FOR 40DIP 18F45J10
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC18F24J10-ISO PDF datasheet #2
- PIC18F24J10-ISO PDF datasheet #3
- PIC18F24J10-ISO PDF datasheet #4
- PIC18F24J10-ISO PDF datasheet #5
- PIC18LF24J10-ISS PDF datasheet #6
- Current page: 225 of 368
- Download datasheet (6Mb)
18.7
The A/D converter in the PIC18F45J10 family of
devices includes a self-calibration feature which com-
pensates for any offset generated within the module.
The calibration process is automated and is initiated by
setting the ADCAL bit (ADCON0<7>). The next time
the GO/DONE bit is set, the module will perform a
“dummy” conversion (that is, with reading none of the
input channels) and store the resulting value internally
to compensate for offset. Thus, subsequent offsets will
be compensated.
The calibration process assumes that the device is in a
relatively steady-state operating condition. If A/D
calibration is used, it should be performed after each
device Reset or if there are other major changes in
operating conditions.
18.8
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed mode.
TABLE 18-2:
© 2009 Microchip Technology Inc.
INTCON
PIR1
PIE1
IPR1
PIR2
PIE2
IPR2
ADRESH
ADRESL
ADCON0
ADCON1
ADCON2
PORTA
TRISA
PORTB
TRISB
LATB
PORTE
TRISE
LATE
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion.
Note 1:
Name
(1)
(1)
(1)
A/D Converter Calibration
Operation in Power-Managed
Modes
These registers and/or bits are not implemented on 28-pin devices and should be read as ‘0’.
PORTB Data Direction Control Register
PORTB Data Latch Register (Read and Write to Data Latch)
GIE/GIEH PEIE/GIEL TMR0IE
A/D Result Register High Byte
A/D Result Register Low Byte
PSPIF
PSPIE
PSPIP
OSCFIF
OSCFIE
OSCFIP
ADCAL
ADFM
Bit 7
RB7
IBF
—
—
—
—
—
REGISTERS ASSOCIATED WITH A/D OPERATION
(1)
(1)
(1)
CMIE
CMIP
ADIE
ADIP
CMIF
ADIF
Bit 6
RB6
OBF
—
—
—
—
—
—
—
TRISA5
VCFG1
ACQT2
CHS3
RCIE
RCIP
IBOV
RCIF
Bit 5
RA5
RB5
—
—
—
—
—
PSPMODE
VCFG0
ACQT1
INT0IE
CHS2
TXIE
TXIP
Bit 4
TXIF
RB4
—
—
—
—
—
—
—
PIC18F45J10 FAMILY
SSP1IE
SSP1IP
TRISA3
SSP1IF
BCL1IF
BCL1IE
BCL1IP
PCFG3
ACQT0
CHS1
If the A/D is expected to operate while the device is in
a power-managed mode, the ACQT<2:0> and
ADCS<2:0> bits in ADCON2 should be updated in
accordance with the power-managed mode clock that
will be used. After the power-managed mode is entered
(either of the power-managed Run modes), an A/D
acquisition or conversion may be started. Once an
acquisition or conversion is started, the device should
continue to be clocked by the same power-managed
mode clock source until the conversion has been com-
pleted. If desired, the device may be placed into the
corresponding power-managed Idle mode during the
conversion.
If the power-managed mode clock frequency is less
than 1 MHz, the A/D RC clock source should be
selected.
Operation in the Sleep mode requires the A/D RC clock
to be selected. If bits, ACQT<2:0>, are set to ‘000’ and
a conversion is started, the conversion will be delayed
one instruction cycle to allow execution of the SLEEP
instruction and entry to Sleep mode. The IDLEN and
SCS bits in the OSCCON register must have already
been cleared prior to starting the conversion.
RBIE
Bit 3
RA3
RB3
—
—
—
PORTE Data Latch Register
(Read and Write to Data Latch)
TMR0IF
CCP1IF
CCP1IE
CCP1IP
TRISA2
TRISE2
PCFG2
ADCS2
CHS0
Bit 2
RA2
RB2
RE2
—
—
—
GO/DONE
TMR2IE
TMR2IP
TMR2IF
TRISA1
TRISE1
PCFG1
ADCS1
INT0IF
Bit 1
RA1
RB1
RE1
—
—
—
TMR1IE
TMR1IP
TMR1IF
CCP2IF
CCP2IE
CCP2IP
TRISA0
TRISE0
PCFG0
ADCS0
ADON
Bit 0
RBIF
DS39682E-page 223
RA0
RB0
RE0
on page
Values
Reset
47
49
49
49
49
49
49
48
48
48
48
48
50
50
50
50
50
50
50
50
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