HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 428
![IC H8 MCU FLASH 56K 64-LQFP](/photos/28/61/286107/64-lqfp__plqp0064kc-a_sml.jpg)
HD64F3687GFP
Manufacturer Part Number
HD64F3687GFP
Description
IC H8 MCU FLASH 56K 64-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3684GFPV.pdf
(538 pages)
Specifications of HD64F3687GFP
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Part Number:
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Manufacturer:
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Quantity:
10 000
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HD64F3687GFPMV
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Section 23 Electrical Characteristics
23.2.2
Table 23.2 DC Characteristics (1)
V
Note: Connect the TEST pin to Vss.
Rev.5.00 Nov. 02, 2005 Page 394 of 500
REJ09B0027-0500
Item
Input high
voltage
Input low
voltage
CC
= 3.0 to 5.5 V, V
DC Characteristics
Symbol
V
V
IH
IL
Applicable Pins
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1,SCK3,
SCK3_2, TRGV
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72
P74 to P76,
P85 to P87
PB0 to PB7
OSC1
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
SS
= 0.0 V, T
a
= –20 to +75°C, unless otherwise indicated.
Test Condition
V
V
V
V
V
CC
CC
CC
CC
CC
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
Min
V
V
V
V
V
V
V
V
–0.3
–0.3
CC
CC
CC
CC
CC
CC
CC
CC
– 0.5
– 0.3
0.8
0.9
0.7
0.8
0.7
0.8
Values
Typ
—
—
—
—
—
—
—
—
—
—
Max
V
V
V
V
AV
AV
V
V
V
V
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
+ 0.3
+ 0.3
+ 0.3
+ 0.3
+ 0.3
+ 0.3
+ 0.3 V
+ 0.3
0.2
0.1
Unit
V
V
V
V
Notes
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