HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 462
![IC H8 MCU FLASH 56K 64-LQFP](/photos/28/61/286107/64-lqfp__plqp0064kc-a_sml.jpg)
HD64F3687GFP
Manufacturer Part Number
HD64F3687GFP
Description
IC H8 MCU FLASH 56K 64-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet
1.HD64F3684GFPV.pdf
(538 pages)
Specifications of HD64F3687GFP
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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HD64F3687GFP
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Renesas Electronics America
Quantity:
10 000
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HD64F3687GFPMV
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Section 23 Electrical Characteristics
23.3.8
Table 23.20 Power-On Reset Circuit Characteristics
V
Note:
23.4
Rev.5.00 Nov. 02, 2005 Page 428 of 500
REJ09B0027-0500
Item
Pull-up resistance of RES pin
Power-on reset start voltage*
SS
= 0.0 V, T
*
Power-On Reset Circuit Characteristics (Optional)
Operation Timing
The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
a
OSC1
= –20 to +75°C, unless otherwise indicated.
t
CPr
V
IL
V
IH
Figure 23.1 System Clock Input Timing
t
CPH
Symbol
R
V
t
por
RES
OSC
t
t
CPf
CPL
Test
Condition
Min
100
—
Typ
150
—
Values
Max
—
100
Unit
k
mV
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