MAXQ622G-0000+ Maxim Integrated Products, MAXQ622G-0000+ Datasheet - Page 14

• Manufacturer Part Number: MAXQ622G-0000+
• Description: IC MCU 16BIT 64K IR MOD 64LQFP
• Manufacturer: Maxim Integrated Products
• Series: MAXQ™r

Specifications of MAXQ622G-0000+

• Core Processor: RISC
• Core Size: 16-Bit
• Speed: 12MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
• Number Of I /o: 44
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 1.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 64-LQFP
• Processor Series: MAXQ622
• Core: RISC
• Data Bus Width: 16 bit
• Data Ram Size: 6 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 12 MHz
• Number Of Programmable I/os: 44
• Number Of Timers: 2
• Operating Supply Voltage: 1.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MAXQUSBJTAG-KIT MAXQ622-KIT
• Minimum Operating Temperature: 0 C
• For Use With: MAXQ622-KIT# - EVALUATION KIT FOR MAXQ622
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

16-Bit Microcontrollers with
Infrared Module and Optional USB
14
MAXQ612
TQFN-EP
_____________________________________________________________________________________
12
16
17
42
43
—
—
—
—
—
MAXQ612
LQFP
PIN
15
25
26
64
—
—
—
—
—
1
MAXQ622
LQFP
15
25
26
19
16
18
20
21
64
1
HFXOUT
RESET
NAME
HFXIN
V
V
V
IRRX
IRTX
DDIO
DM
DP
DDB
BUS
USB FUNCTION PINS
IR FUNCTION PINS
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this
pin is low and begins executing from the reset vector when released. The
pin includes pullup current source and should be driven by an open-drain,
external source capable of sinking in excess of 4mA. This pin is driven low
as an output when an internal reset condition occurs.
High-Frequency Crystal Input. Connect an external crystal or resona-
tor between HFXIN and HFXOUT as the high-frequency system clock.
Alternatively, HFXIN is the input for an external, high-frequency clock
source when HFXOUT is shorted to ground during POR.
IR Transmit Output. Active-low IR transmit pin capable of sinking 25mA.
This pin defaults to three-state input with the weak pullup disabled dur-
ing all forms of reset. Software must configure this pin after release from
reset to remove the three-state input condition.
IR Receive Input
USB V
ply. Bypass V
the V
USB D+ Signal. This bidirectional pin carries the positive differential
data or single-ended data. Connect this pin to a USB “B” connector.
This pin is weakly pulled high internally when the USB is disabled.
USB D- Signal. This bidirectional pin carries the negative differential
data or single-ended data. Connect this pin to a USB “B” connector.
This pin is weakly pulled high internally when the USB is disabled.
USB Transceiver Supply Voltage. This is the power output of the internal
voltage regulator that is used for the USB transceiver (3.3V) block. This
pin is bypassed to ground with a 1.0FF capacitor as close as possible
to the package. No external circuitry should be powered from this pin.
Switched 3V Power Supply. This is the power output after selection
between V
chip capacitor. The capacitor must be placed as close to this pin as
possible. No external devices other than the capacitor should be con-
nected to this pin.
CLOCK PINS
RESET PINS
BUS
BUS
pin as possible.
BUS
Supply Voltage. Connect V
BUS
and V
to ground with a 1.0FF ceramic capacitor as close to
DD
Pin Description (continued)
. Must be connected to an external ceramic
FUNCTION
BUS
to a positive 5.0V power sup-