SAF-TC1167-128F133HL AD Infineon Technologies, SAF-TC1167-128F133HL AD Datasheet - Page 123

• Manufacturer Part Number: SAF-TC1167-128F133HL AD
• Description: IC MCU 32BIT FLASH 176-LQFP
• Manufacturer: Infineon Technologies
• Series: TC116xr

Specifications of SAF-TC1167-128F133HL AD

• Core Processor: TriCore
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: ASC, CAN, EBI/EMI, MLI, MSC, SSC
• Peripherals: DMA, POR, WDT
• Number Of I /o: 88
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.42 V ~ 1.58 V
• Data Converters: A/D 32x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFQFP
• Data Bus Width: 32 bit
• Data Ram Size: 104 KB
• Interface Type: ASC, MLI, MSC, SSC
• Maximum Clock Frequency: 133 MHz
• Number Of Programmable I/os: 88
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 16 Channel) / 10 bit, 4 Channel
• Packages: PG-LQFP-176
• Max Clock Frequency: 133.0 MHz
• Sram (incl. Cache): 128.0 KByte
• Can Nodes: 2
• A / D Input Lines (incl. Fadc): 36
• Program Memory: 1.0 MB
• For Use With: B158-H8690-X-0-7600IN - KIT STARTER TC116X SERIES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000602800

5.4
5.4.1
Table 25
Device
TC1167
1) The top and bottom thermal resistances between the case and the ambient (
Data Sheet
with the thermal resistances between the junction and the case given above (
the total thermal resistance between the junction and the ambient (
case and the ambient (
under user responsibility.
The junction temperature can be calculated using the following equation:
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
TJA
can be obtained from the upper four partial thermal resistances.
Package
PG-LQFP-176-5
Package and Reliability
Package Parameters
Thermal Parameters (Operating Conditions apply)
R
TCAT
,
R
TCAB
R
6.5
) depend on the external system (PCB, case) characteristics, and are
ΘJCT
1)
118
R
5.5
ΘJCB
1)
R
R
23
TJA
ΘJLeads
). The thermal resistances between the
T
J
R
R
1)
=
TJCT
TCAT
T
Electrical Parameters
A
Unit
K/W
,
,
+
R
R
R
TJCB
TCAB
TJA
), in order to calculate
) are to be combined
×
P
D
V1.3, 2009-10
, where the
Note
TC1167
R
TJA