MC68HC908AP64CB Freescale Semiconductor, MC68HC908AP64CB Datasheet - Page 300

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MC68HC908AP64CB

Manufacturer Part Number
MC68HC908AP64CB
Description
IC MCU 64K FLASH 8MHZ 42SDIP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908AP64CB

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, IRSCI, SCI, SPI
Peripherals
LED, LVD, POR, PWM
Number Of I /o
30
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
42-DIP (0.600", 15.24mm)
For Use With
DEMO908AP64E - BOARD DEMO FOR 908AP64DEMO908AP64 - BOARD DEMO FOR 908AP64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Electrical Specifications
22.3 Functional Operating Range
22.4 Thermal Characteristics
298
Operating temperature range
Operating voltage range
Thermal resistance
I/O pin power dissipation
Power dissipation
Constant
Average junction temperature
Maximum junction temperature
1. Power dissipation is a function of temperature.
2. K constant unique to the device. K can be determined for a known T
42-Pin SDIP
44-Pin QFP
48-Pin LQFP
With this value of K, P
(2)
Characteristic
Characteristic
(1)
Table 22-3. Thermal Characteristics
MC68HC908AP Family Data Sheet, Rev. 4
D
and T
Table 22-2. Operating Range
J
can be determined for any value of T
Symbol
Symbol
V
P
T
θ
P
T
T
K
DD
JA
I/O
JM
A
D
J
P
D
= (I
P
User determined
K/(T
D
T
A
x (T
– 40 to +85
DD
+ P
2.7 to 5.5
+ (P
J
Value
Value
× V
A
D
+ 273 °C)
100
60
95
80
2
+ 273 °C)
D
DD
× θ
× θ
) + P
JA
JA
A
A
.
and measured P
)
I/O
=
Freescale Semiconductor
°C/W
°C/W
°C/W
W/°C
Unit
Unit
°C
°C
°C
W
W
V
D.

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