HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 44

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Section 14 A/D Converter
Table 14.1
Table 14.2
Table 14.3
Table 14.4
Table 14.5
Section 15 D/A Converter
Table 15.1
Table 15.2
Section 16 RAM
Table 16.1
Table 16.2
Section 17 Clock Pulse Generator
Table 17.1 (1) Damping Resistance Value................................................................................. 449
Table 17.1 (2) External Capacitance Values.............................................................................. 450
Table 17.2
Table 17.3
Table 17.4
Section 18 Power-Down State
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Section 19 Electrical Characteristics
Table 19.1
Table 19.2
Table 19.2
Table 19.3
Table 19.4
Table 19.5
Table 19.6
Table 19.7
Table 19.8
Table 19.9
Rev.4.00 Aug. 20, 2007 Page xlii of xliv
REJ09B0395-0400
A/D Converter Pins ............................................................................................ 413
A/D Converter Registers .................................................................................... 414
Analog Input Channels and A/D Data Registers (ADDRA to ADDRD) ........... 415
A/D Conversion Time (Single Mode) ................................................................ 426
Analog Input Pin Ratings ................................................................................... 429
D/A Converter Pins ............................................................................................ 437
D/A Converter Registers .................................................................................... 437
H8/3008 On-Chip RAM Specifications ............................................................. 443
System Control Register..................................................................................... 444
Crystal Resonator Parameters............................................................................. 450
Clock Timing (Preliminary) ............................................................................... 452
Frequency Division Register .............................................................................. 454
Power-Down State and Module Standby Function ............................................ 458
Control Register ................................................................................................. 459
Clock Frequency and Waiting Time for Clock to Settle .................................... 466
φ Pin State in Various Operating States ............................................................. 470
Absolute Maximum Ratings............................................................................... 471
DC Characteristics (1) ........................................................................................ 472
DC Characteristics (2) ........................................................................................ 475
Permissible Output Currents............................................................................... 477
Clock Timing...................................................................................................... 479
Control Signal Timing........................................................................................ 480
Bus Timing......................................................................................................... 481
Timing of On-Chip Supporting Modules ........................................................... 483
A/D Conversion Characteristics ......................................................................... 485
D/A Conversion Characteristics ......................................................................... 487

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