HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 260
HD64F2239TF20I
Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2238RFA6V.pdf
(1048 pages)
Specifications of HD64F2239TF20I
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 7 Bus Controller
Figure 7.24 shows the timing for transition to the bus-released state.
7.9.1
When MSTPCR is set to H'FFFFFF and transmitted to sleep mode, the external bus release does
not function. To activate the external bus release in sleep mode, do not set MSTPCR to H'FFFFFF.
Rev. 6.00 Mar. 18, 2010 Page 198 of 982
REJ09B0054-0600
Address bus
HWR, LWR
Data bus
Bus Release Usage Note
Note : n = 7 to 0
[1]
[2]
[3]
[4]
[5]
BREQ
BACK
CSn
RD
AS
φ
Low level of BREQ pin is sampled at rise of T
BACK pin is driven low at end of CPU read cycle, releasing bus to external bus
master.
BREQ pin state is still sampled in external bus released state.
High level of BREQ pin is sampled.
BACK pin is driven high, ending bus release cycle.
Figure 7.24 Bus-Released State Transition Timing
T
0
CPU cycle
T
Address
1
[1]
Minimum
1 state
T
2
2
[2]
state.
External bus released state
[3]
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
[4]
CPU
cycle
[5]
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