MPC5553MZP132 Freescale Semiconductor, MPC5553MZP132 Datasheet - Page 60

• Manufacturer Part Number: MPC5553MZP132
• Description: IC MCU MPC5553 REV A 416-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC55xx Qorivvar

Specifications of MPC5553MZP132

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 220
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 416-PBGA
• Processor Series: MPC5xxx
• Core: e200z6
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: 7-Wire, DSPI, ESCI
• Maximum Clock Frequency: 132 MHz
• Number Of Timers: 56
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• For Use With: MPC5553EVBISYS - KIT EVAL ISYSTEMS MPC5553MPC5553EVBGHS - KIT EVAL GREEN HILLS SOFTWAREMPC5553EVB - KIT EVAL MPC5553MZP132MPC5553EVBE - BOARD EVAL FOR MPC5553
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

Revision History for the MPC5553 Data Sheet
5
The history of revisions made to this data sheet are described in this section. The changes are divided into
each revision of this document.
The substantive changes incorporated in MPC5553 Data Sheet Rev. 2.0 to produce Rev. 3.0 are:
Within each group, the changes are listed in sequential page number order.
5.1
The following table lists the global changes incorporated throughout the document, and substantive text
changes made to paragraphs.
60
Global Changes
Section 1,
3.7.1, 3.7.2 and 3.7.3:
Location
•
•
Global and text changes
Table and figure changes
“Overview”:
Revision History for the MPC5553 Data Sheet
Information Changed Between Revisions 2.0 and 3.0
Starting at the third paragraph and throughout the document, replaced:
• kilobytes with KB
• megabytes with MB
• Changed WE[0:1]/BE[0:1] to WE/BE[0:1].
• First paragraph, text changed from “ based on the PowerPC Book E architecture” to “built on the Power
• Second paragraph: Changed terminology from PowerPC Book E architecture to Power Architecture terminology.
• Put overbars on the following signals: BDIP, OE, TA, TS, TEA
• Added the sentence directly preceding
• First paragraph, text changed from “ based on the PowerPC Book E architecture” to “built on the Power
• Second paragraph: Changed terminology from PowerPC Book E architecture to Power Architecture terminology.
•
•
•
Architecture embedded technology.”
from T
Architecture embedded technology.”
Section 3.7.1, “Input Value of Pins During POR Dependent on
Section 3.7.2, “Power-Up Sequence (VRC33
Section 3.7.3, “Power-Down Sequence (VRC33
L
to T
Reordered sections resulting in the following order and section renumbering:
H
Table 32. Global and Text Changes Between Rev. 2.0 and 3.0
.’
MPC5553 Microcontroller Data Sheet, Rev. 3.0
Table
Description of Change
1: ‘Unless noted in this data sheet, all specifications apply
Grounded),” then
Grounded).
VDD33,” then
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