DSP56311VF150R2 Freescale Semiconductor, DSP56311VF150R2 Datasheet - Page 22

• Manufacturer Part Number: DSP56311VF150R2
• Description: IC DSP 24BIT 150MHZ 196-BGA
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of DSP56311VF150R2

• Interface: Host Interface, SSI, SCI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (576 B)
• On-chip Ram: 384kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 196-MAPBGA
• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 384KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.7/1.7/3/3/3/3/3/3V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Specifications
2.2 Thermal Characteristics
2-2
Junction-to-ambient, natural convection, single-layer board (1s)
Junction-to-ambient, natural convection, four-layer board (2s2p)
Junction-to-ambient, @200 ft/min air flow, single layer board (1s)
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)
Junction-to-board
Junction-to-case thermal resistance
Junction-to-package-top, natural convection
Junction-to-package-top, @200 ft/min air flow
Notes:
1.
2.
3.
4.
5.
6.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
4
Thermal Resistance Characteristic
5
6
6
Table 2-2.
DSP56311 Technical Data, Rev. 8
1,2
Thermal Characteristics
1,3
1,3
1,3
Symbol
R
R
R
R
R
R
Ψ
Ψ
θJMA
θJMA
θJMA
θJA
θJB
θJC
JT
JT
Freescale Semiconductor
MAP-BGA
Value
49
26
39
22
14
5
2
2
°
°
°
°
°
°
°
°
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W