MCIMX357DVM5B Freescale Semiconductor, MCIMX357DVM5B Datasheet - Page 29

• Manufacturer Part Number: MCIMX357DVM5B
• Description: PROCESSOR MULTIMEDIA 400PBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX35r

Specifications of MCIMX357DVM5B

• Core Processor: ARM11
• Core Size: 32-Bit
• Speed: 532MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 400-BGA
• Operating Temperature (min): -20C
• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: BGA
• No. Of Pins: 400
• Operating Temperature Range: -20°C To +70°C
• Processor Type: I.MX35
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

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4.9
This section contains the AC electrical information (including timing specifications) for the modules of
the i.MX35. The modules are listed in alphabetical order.
4.9.1
The AUDMUX provides a programmable interconnect logic for voice, audio and data routing between
internal serial interfaces (SSI) and external serial interfaces (audio and voice codecs). The AC timing of
AUDMUX external pins is hence governed by the SSI module. See the electrical specification for SSI.
4.9.2
The i.MX35 provides two CSPI modules. CSPI ports are multiplexed in the i.MX35 with other pins. See
the “External Signals and Multiplexing” chapter of the reference manual for more details.
Freescale Semiconductor
Table 25. AC Electrical Characteristics of DDR Type IO Pins in SDRAM Mode Max Drive (1.8 V) (continued)
Output pin di/dt (max. drive)
Input pin transition times
Input pin propagation delay, 50%–50%
Input pin propagation delay, 40%–60%
Min. condition for tps: wcs model, 1.1 V, IO 1.65 V, and 105 °C. tps is measured between VIL to VIH for rising edge and between
VIH to VIL for falling edge.
Max. condition for tdit: bcs model, 1.3 V, IO 1.95 V, and –40 °C.
Max. condition for tpi and trfi: wcs model, 1.1 V, IO 1.65 V and 105 °C. Min. condition for tpi and trfi: bcs model, 1.3 V, IO 1.95 V
and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Module-Level AC Electrical Specifications
AUDMUX Electrical Specifications
CSPI AC Electrical Specifications
Parameter
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
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Symbol
didt
trfi
tpi
tpi
Test Condition
1.0 pF
1.0 pF
1.0 pF
25 pF
50 pF
Rise/Fall
0.07/0.08
0.35/1.17
1.18/1.99
Min.
89
95
0.11/0.12
0.63/1.53
1.45/2.35
Typ.
202
213
Rise/Fall
0.16/0.20
1.16/2.04
1.97/2.85
Max.
435
456
mA/ns
Units
ns
ns
ns
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