MCIMX31LCVMN4C Freescale Semiconductor, MCIMX31LCVMN4C Datasheet - Page 102

IC MPU MAP I.MX31L 473-MAPBGA

MCIMX31LCVMN4C

Manufacturer Part Number
MCIMX31LCVMN4C
Description
IC MPU MAP I.MX31L 473-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX31r
Datasheets

Specifications of MCIMX31LCVMN4C

Core Processor
ARM11
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, ATA, EBI/EMI, FIR, I²C, MMC/SD, PCMCIA, SIM, SPI, SSI, UART/USART, USB, USB OTG
Peripherals
DMA, LCD, POR, PWM, WDT
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.22 V ~ 3.3 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
473-MAPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX31LCVMN4C
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX31LCVMN4CR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Information and Pinout
5.1.3
Table 62
page 103
5.1.3.1
GND/PWR ID
FGND
FUSE_VDD
FVCC
GND
IOQVDD
MGND
MVCC
NVCC1
NVCC2
NVCC3
NVCC4
NVCC5
NVCC6
NVCC7
NVCC8
NVCC9
NVCC10
NVCC21
NVCC22
QVCC
QVCC1
QVCC4
SGND
SVCC
UVCC
UGND
102
shows the device connection list for power and ground, alpha-sorted followed by
which shows the no-connects.
Connection Tables–
U16
T15
T16
A1, A2, A3, A21, A22, A23, B1, B2, B22, B23, C1, C2, C22, C23, D22, D23, J12, J13, K10, K11, K12, K13, K14,
L10, L11, L12, L13, L14, M9, M10, M11, M12, M13, M14, N10, N11, N12, N13, N14, P10, P11, P12, P13, P14,
R12, Y1, Y23, AA1, AA2, AA22, AA23, AB1, AB2, AB21, AB22, AB23, AC1, AC2, AC21, AC22, AC23
T8
U14
U15
G15, G16, H16, J17
G9, G10, H8, H9
G11, G12, G13, H12
G14
P8, R7, R8, R9, T9
H13, J14, L15, M15, N9, N15, P9, P15, R10, R11, R13, R14
J8, J9, J10, K9
L9, M7, M8, N8
U13
U12
P18
P17
N16, P16, R15, R16, T14
K7, K8, L7, L8
H14, J15, K15
H15, J16, K16, L16, M16
H10, H11, J11
T11, T12, T13, U11
T10, U7, U8, U9, U10, V6, V7, V8, V9, V10
Ground and Power ID Locations—
Table 62. 19 x 19 BGA Ground/Power ID by Ball Grid Location
MCIMX31C/MCIMX31LC Technical Data, Rev. 4.3
19 x 19 mm 0.8 mm
Table 64 on page 103
Ball Location
19 x 19 mm 0.8 mm
shows the device connection list for signals.
Freescale Semiconductor
Table 63 on

Related parts for MCIMX31LCVMN4C