MCIMX31LCVMN4C Freescale Semiconductor, MCIMX31LCVMN4C Datasheet - Page 44

IC MPU MAP I.MX31L 473-MAPBGA

MCIMX31LCVMN4C

Manufacturer Part Number
MCIMX31LCVMN4C
Description
IC MPU MAP I.MX31L 473-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX31r
Datasheets

Specifications of MCIMX31LCVMN4C

Core Processor
ARM11
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, ATA, EBI/EMI, FIR, I²C, MMC/SD, PCMCIA, SIM, SPI, SSI, UART/USART, USB, USB OTG
Peripherals
DMA, LCD, POR, PWM, WDT
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.22 V ~ 3.3 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
473-MAPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX31LCVMN4C
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX31LCVMN4CR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
44
1
SD11 and SD12 are determined by SDRAM controller register settings.
SD13
SD14
ADDR
ID
RAS
CAS
SDCLK
SDCLK
WE
CS
SD6
SDR SDRAM CLK parameters are being measured from the 50%
point—that is, high is defined as 50% of signal value and low is defined as
50% of signal value.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is,
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
Data setup time
Data hold time
BA
Table 32. SDR SDRAM Write Timing Parameters (continued)
SD7
Table 32
Figure 35. SDRAM Refresh Timing Diagram
MCIMX31C/MCIMX31LC Technical Data, Rev. 4.3
SD11
Parameter
indicates SDRAM requirements. All output signals
NOTE
NOTE
SD10
SD1
SD3
Symbol
tDH
tDS
SD2
SD10
Min
2.0
1.3
ROW/BA
Freescale Semiconductor
Max
Unit
ns
ns

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