MCIMX281AVM4B Freescale Semiconductor, MCIMX281AVM4B Datasheet - Page 3

• Manufacturer Part Number: MCIMX281AVM4B
• Description: IC MPU I.MX28 1.2 289MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX28r

Specifications of MCIMX281AVM4B

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 454MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Program Memory Size: 128KB (32K x 32)
• Program Memory Type: Mask ROM
• Ram Size: 32K x 32
• Voltage - Supply (vcc/vdd): 1.25 V ~ 5.25 V
• Data Converters: A/D 17x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 289-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

2.3
Create a chassis ground ring connecting the entire perimeter of the PCB. The purpose of this is to improve
ESD performance and help reduce radiated emissions. The chassis ground ring should be a minimum of
1.27 mm (50 mils) wide, if possible, and be routed on all layers with the rings stitched together with GND
vias. On top and bottom layers the solder mask should be cleared from the ground ring as shown below.
3
The i.MX28 processor has an integrated power management unit (PMU) that includes a multi-channel
output DCDC converter. This section describes the important layout considerations for the PMU.
3.1
Freescale Semiconductor
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PMU and DC-DC Converter
Use at least two ground vias immediately next to the DCDC_GND pin. The DCDC_GND pin
switches large amounts of current at a high frequency; decreasing the impedance to the ground
plane reduces DCDC converter noise and increases stability.
Chassis Ground Ring
Vias
i.MX28 Layout and Design Guidelines, Rev. 0
PMU and DC-DC Converter
3