MCIMX281AVM4B Freescale Semiconductor, MCIMX281AVM4B Datasheet - Page 6
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MCIMX281AVM4B
Manufacturer Part Number
MCIMX281AVM4B
Description
IC MPU I.MX28 1.2 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r
Datasheets
1.MCIMX283DVM4B.pdf
(2327 pages)
2.MCIMX283DVM4B.pdf
(20 pages)
3.MCIMX281AVM4B.pdf
(72 pages)
Specifications of MCIMX281AVM4B
Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed
Analog
4
Place sensitive analog components including the low resolution ADC (LRADC), high speed ADC
(HSADC), crystal circuit, analog audio, etc. in a section of the PCB that is isolated from digital
components and traces.
4.1
4.2
6
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Try placing the negative battery terminal close to the DCDC_GND pin if possible. This will reduce
the length of the DCDC switching current ground return path and reduce overall PCB noise.
Analog
0.01uF capacitors should be placed close to the LRADC input pins and away from digital and
DCDC components and traces.
The LRADC and HSADC traces should be routed adjacent to a ground plane the entire length of
the trace. Crossing plane splits should be avoided. The traces should be routed far away from
digital and DCDC components and traces.
Minimal capacitance, no greater than 0.01uF, should be placed on the HSADC pin due to its high
sample rate; 2Msps with 12 bit resolution. Placing a large amount of capacitance on the HSADC
trace can reduce the accuracy and conversion speed due to limiting the analog signal rate of change.
The HSADC signal must be routed only adjacent to ground planes – above and below if placed on
an internal layer. It should be routed at least 50 mils away from other traces. At least 50mils of
ground shielding on both sides of trace is recommended as shown below.
Place the crystal and load capacitors as close as possible to the XTALI and XTALO pins.
Place the VDD_XTAL capacitor close to the VDD_XTAL pin, and ground the capacitor away from
digital traces.
These rules apply to both the 24.000 MHz and 32.768 kHz crystal circuits. The drawing below
shows an example layout for the 24.000 MHz crystal circuit. In this drawing, all circuit components
are routed on the top layer above a ground plane.
Analog-to-Digital Converters
Crystal
i.MX28 Layout and Design Guidelines, Rev. 0
Freescale Semiconductor