MCIMX281AVM4B Freescale Semiconductor, MCIMX281AVM4B Datasheet - Page 8

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MCIMX281AVM4B

Manufacturer Part Number
MCIMX281AVM4B
Description
IC MPU I.MX28 1.2 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r
Datasheets

Specifications of MCIMX281AVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Supplier Unconfirmed
DRAM Memory
5.2
The guidelines below mainly focus on DDR2 routing (including low voltage,1.5V, DDR2). However, most
of the these guidelines also apply to mDDR.
Summary of key signal groups:
8
Vias can be strategically placed to create channels for the supply bypass capacitors to be placed
underneath the i.MX28 processor and close to the EMI supply pins as shown below:
Address/Command (Ax, BAx, RAS#, CAS#, WE#)
— Single ended, parallel, terminated to VTT, registered on rising edge of clock.
Control (CS#, CKE, ODT)
— Single ended, parallel, terminated to VTT, registered on rising edge of clock.
— Each bank has its own control signal (less loading).
Clocks (CLK, CLK#)
— Differential, terminated on die with ODT.
Data mask (DQMx)
— Single ended input, terminated on die with ODT.
— One data mask for each byte lane.
Routing
i.MX28 Layout and Design Guidelines, Rev. 0
Freescale Semiconductor

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