UJA1061TW/5V0/C/T/ NXP Semiconductors, UJA1061TW/5V0/C/T/ Datasheet - Page 19

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UJA1061TW/5V0/C/T/

Manufacturer Part Number
UJA1061TW/5V0/C/T/
Description
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheets

Specifications of UJA1061TW/5V0/C/T/

Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Applications
Automotive Networking
Interface
CAN, LIN
Voltage - Supply
5.5 V ~ 27 V
Mounting Type
Surface Mount
Product
Controller Area Network (CAN)
Number Of Transceivers
2
Supply Voltage (max)
27 V, 52 V
Supply Voltage (min)
5.5 V
Supply Current (max)
10 mA, 25 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935288866512
NXP Semiconductors
TDA8922C_1
Product data sheet
Equation 5
of TFB and total thermal resistance from junction to ambient.
Power dissipation (P) is determined by the efficiency of the TDA8922C. Efficiency
measured as a function of output power is given in
derived as a function of output power as shown in
Fig 9.
(1) R
(2) R
(3) R
(4) R
(5) R
Derating curves for power dissipation as a function of maximum ambient
temperature
th(j-a)
th(j-a)
th(j-a)
th(j-a)
th(j-a)
defines the relationship between maximum power dissipation before activation
= 5 K/W.
= 10 K/W.
= 15 K/W.
= 20 K/W.
= 35 K/W.
Rev. 01 — 7 September 2009
(W)
P
30
20
10
0
0
20
R
th j a
(1)
(2)
(3)
(4)
(5)
40
=
T
----------------------- -
j
60
P
T
Figure
Figure
amb
2
80
T
amb
19.
20. Power dissipation can be
75 W class-D power amplifier
mbl469
( C)
100
TDA8922C
© NXP B.V. 2009. All rights reserved.
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