UJA1061TW/5V0/C/T/ NXP Semiconductors, UJA1061TW/5V0/C/T/ Datasheet - Page 38

• Manufacturer Part Number: UJA1061TW/5V0/C/T/
• Description: IC CAN/LIN FAIL-SAFE HS 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1061TW/5V0/C/T/

• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Applications: Automotive Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Mounting Type: Surface Mount
• Product: Controller Area Network (CAN)
• Number Of Transceivers: 2
• Supply Voltage (max): 27 V, 52 V
• Supply Voltage (min): 5.5 V
• Supply Current (max): 10 mA, 25 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935288866512

NXP Semiconductors
17. Revision history
Table 15.
TDA8922C_1
Product data sheet
Document ID
TDA8922C_1
Revision history
16.4 Package related soldering information
Table 14.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Release date
20090907
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Data sheet status
Product data sheet
Rev. 01 — 7 September 2009
Soldering method
Dipping
-
suitable
-
Change notice
-
2
75 W class-D power amplifier
Supersedes
-
Wave
suitable
suitable
not suitable
TDA8922C
© NXP B.V. 2009. All rights reserved.
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