S29GL256P11TFI020 Spansion Inc., S29GL256P11TFI020 Datasheet - Page 14
![Flash 3V 256Mb Mirrorbit lowest address110ns](/photos/16/11/161172/s29gl512p11tfi020_sml.jpg)
S29GL256P11TFI020
Manufacturer Part Number
S29GL256P11TFI020
Description
Flash 3V 256Mb Mirrorbit lowest address110ns
Manufacturer
Spansion Inc.
Datasheet
1.S29GL128P11TFI020.pdf
(80 pages)
Specifications of S29GL256P11TFI020
Memory Type
NOR
Memory Size
256 Mbit
Access Time
110 ns
Data Bus Width
8 bit, 16 bit
Architecture
Uniform
Interface Type
Page-mode
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
50 mA
Mounting Style
SMD/SMT
Operating Temperature
+ 85 C
Package / Case
TSOP-56
Memory Configuration
128K X 16
Ic Interface Type
Parallel
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
56
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S29GL256P11TFI020
Manufacturer:
SPANSION
Quantity:
5 530
Company:
Part Number:
S29GL256P11TFI020
Manufacturer:
SPANSION
Quantity:
5 530
Company:
Part Number:
S29GL256P11TFI020
Manufacturer:
Spansion
Quantity:
135
4.3
14
LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
D
N
A
E
0.40
0.60
0.50
MIN
---
13.00 mm x 11.00 mm
Figure 4.2 LAA064—64ball Fortified Ball Grid Array (FBGA), 11 x 13 mm
13.00 BSC.
11.00 BSC.
PACKAGE
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAA 064
NONE
NOM
0.60
N/A
---
---
---
64
8
8
MAX
1.40
0.70
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29GL-P MirrorBit
NOTE
D a t a
®
Flash Family
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S h e e t
S29GL-P_00_A12 November 20, 2009
3354 \ 16-038.12d