LPC1113FHN33/301 NXP Semiconductors, LPC1113FHN33/301 Datasheet - Page 39

MCU, 32BIT, 24KFLASH, CORTEX-M0, 33HVQFN

LPC1113FHN33/301

Manufacturer Part Number
LPC1113FHN33/301
Description
MCU, 32BIT, 24KFLASH, CORTEX-M0, 33HVQFN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1113FHN33/301

Controller Family/series
ARM Cortex-M0
No. Of I/o's
28
Ram Memory Size
8KB
Cpu Speed
50MHz
No. Of Timers
4
Core Size
32bit
Program Memory Size
24KB
Oscillator Type
External, Internal
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1113FHN33/301
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1113FHN33/301
Manufacturer:
NXP
Quantity:
2 000
Part Number:
LPC1113FHN33/301
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
Fig 10. Sleep mode: Typical supply current I
Fig 11. Deep-sleep mode: Typical supply current I
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(mA)
(μA)
I
I
DD
DD
40
30
20
10
Conditions: V
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled.
clock frequencies (for LPC111x/101/201/301)
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG = 0x0000 18FF).
supply voltages V
8
6
4
2
0
0
−40
−40
All information provided in this document is subject to legal disclaimers.
DD
Rev. 4 — 10 February 2011
= 3.3 V; sleep mode entered from flash; all peripherals disabled in the
−15
−15
DD
(for LPC111x/101/201/301)
10
10
DD
versus temperature for different system
32-bit ARM Cortex-M0 microcontroller
35
35
DD
LPC1111/12/13/14
versus temperature for different
48 MHz
36 MHz
24 MHz
12 MHz
(2)
(2)
(2)
(1)
60
60
temperature (°C)
temperature (°C)
3.6 V
3.3 V
2.0 V
1.8 V
002aaf392
002aaf394
© NXP B.V. 2011. All rights reserved.
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