AD5560JSVUZ-REEL Analog Devices Inc, AD5560JSVUZ-REEL Datasheet - Page 15

• Manufacturer Part Number: AD5560JSVUZ-REEL
• Description: 1.2A Programmable DPS With DACs
• Manufacturer: Analog Devices Inc
• Type: Power Supplyr

Specifications of AD5560JSVUZ-REEL

• Design Resources: Integrated Device Power Supply for PAD with Output Voltage Range 0 V to 25 V (CN0130)
• Applications: Automatic Test Equipment
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
AV
AV
AV
HCAV
HCAV
HCAV
HCAV
HCAV
HCAV
DV
AGND to DGND
REFGND to AGND
Digital Inputs to DGND
Analog Inputs to AGND
Storage Temperature
Operating Junction Temperature
Reflow Profile
Junction Temperature
Power Dissipation
ESD
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
When an EXTFORCE1 or EXTFORCE2 stage is enabled and the supply
differential |AV
pins are not directly shorted to AV
cause damage to the device.
EXTFORCE1 and EXTFORCE2 to
AGND
HBM
FICDM
DD
DD
SS
CC
to AGND
to AV
to AGND
to DGND
DD
DD
SS
DD
DD
SS
x to AGND
x to AV
1
x to HCAV
x to AGND
x to AV
x to AV
SS
DD
SS
SS
DD
− AV
SS
x
SS
| > 28 V, care should be taken to ensure that these
SS
voltage at any time because this can
Rating
34 V
−0.3 V to +34 V
−34 V to +0.3 V
34 V
−0.3 V to +34 V
−34 V to +0.3 V
−0.3 V to AV
−0.3 V to AV
+0.3 V to AV
−0.3 V to +7 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to DV
AV
AV
−65°C to +125°C
25°C to 90°C
J-STD 20 (JEDEC)
150°C max
10 W max (EXTFORCE1 stage)
5 W max (EXTFORCE2 stage)
1500 V
500 V
SS
DD
− 0.3 V to AV
− 28 V
SS
DD
SS
CC
+ 34 V
− 0.3 V
+ 0.3 V
+ 0.3 V
DD
+ 0.3 V
Rev. C | Page 15 of 60
THERMAL RESISTANCE
Table 4.
Cooling
No Heat
Sink
Heat
Sink
Cold
Plate
1
2
3
4
ESD CAUTION
power stages − local heating), 0.5 mm TIM, 2.56 W/m/k.
T
No heat sink attached; thermal performance of the package depends on
environmental conditions. All numbers are simulated and assume a JEDEC
4-layer test board.
Heat sink attached with a rated performance of θ
111°C at 400 LFM. Thermal performance of the package depends on the heat
sink and environmental conditions. All numbers are simulated and assume a
JEDEC 4-layer test board.
Attached infinite cold plate should be ≤ 30°C to maintain T
performance of the package depends on the heat sink and environmental
conditions. All numbers are simulated and assume a JEDEC 4-layer test
board.
A
= 30°C, T
2
3
4
1
COLD PLATE
Airflow
(LFPM)
0
200
400
0
200
400
N/A
= 30°C, total power = 8.5 W (1 W distributed, 7.5 W in
θ
42
37.2
35.7
12.2
11.1
9.5
N/A
JA
θ
(Uniform
Heating)
1
1
1
JC
CA
~6.2°C/W giving ~T
θ
(Local
Heating)
4.91
4.91
4.91
JC
J
< 90°C. Thermal
AD5560
J
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
=