AD9779A-EBZ Analog Devices Inc, AD9779A-EBZ Datasheet - Page 60

• Manufacturer Part Number: AD9779A-EBZ
• Description: Dual 16B, 1.0 GSPS TxDAC
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9779A-EBZ

• Design Resources: Interfacing ADL5370 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0016) Interfacing ADL5371 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0017) Interfacing ADL5372 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0018) Interfacing ADL5373 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0019) Interfacing ADL5374 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0020) Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021)
• Number Of Dac's: 2
• Number Of Bits: 16
• Outputs And Type: 2, Differential
• Sampling Rate (per Second): 1G
• Data Interface: Serial
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9779A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Settling Time: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9776A/AD9778A/AD9779A
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9776ABSVZ
AD9776ABSVZRL
AD9778ABSVZ
AD9778ABSVZRL
AD9779ABSVZ
AD9779ABSVZRL
AD9776A-EBZ
AD9778A-EBZ
AD9779A-EBZ
1
©2007–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
PLANE
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
25
Figure 113. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
D06452-0-3/08(A)
1
100
26
0.50 BSC
16.00 BSC SQ
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
(PINS DOWN)
Package Description
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
Evaluation Board
TOP VIEW
14.00 BSC SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. A | Page 60 of 60
(SV-100-1)
0.15
0.05
50
76
75
51
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
100
26
1
25
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1