ADN4604ASVZ-RL Analog Devices Inc, ADN4604ASVZ-RL Datasheet - Page 37

• Manufacturer Part Number: ADN4604ASVZ-RL
• Description: 4.25Gbps 16x16 Crossbar Switch
• Manufacturer: Analog Devices Inc
• Series: XStream™r

Specifications of ADN4604ASVZ-RL

• Function: Crosspoint Switch
• Circuit: 1 x 16:16
• On-state Resistance: 56 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 2.7 V ~ 3.6 V
• Current - Supply: 95mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Large voids in the thermal paddle area should be avoided. To
control voids in the thermal paddle area, solder masking may be
required for thermal vias to prevent solder wicking inside the
via during reflow, thus displacing the solder away from the
interface between the package thermal paddle and thermal
paddle land on the PCB. There are several methods employed
for this purpose, such as via tenting (top or bottom side), using
dry film solder mask; via plugging with liquid photo-imagible
(LPI) solder mask from the bottom side; or via encroaching.
These options are depicted in Figure 58. In case of via tenting,
the solder mask diameter should be 100 microns larger than the
via diameter.
Rev. 0 | Page 37 of 40
Top; (B) Via Tenting from the Bottom; (C) Via Plugging, Bottom; and (D) Via
Figure 58. Solder Mask Options for Thermal Vias: (A) Via Tenting from the
(A)
SOLDER
MASK
Encroaching, Bottom
(B)
VIA
(C)
COPPE
PLATING
(D)
ADN4604
R