BSO200P03S Infineon Technologies, BSO200P03S Datasheet - Page 2

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BSO200P03S

Manufacturer Part Number
BSO200P03S
Description
MOSFET P-CH 30V 7.4A DSO-8
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of BSO200P03S

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
20 mOhm @ 9.1A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
7.4A
Vgs(th) (max) @ Id
1.5V @ 100µA
Gate Charge (qg) @ Vgs
54nC @ 10V
Input Capacitance (ciss) @ Vds
2330pF @ 25V
Power - Max
1.56W
Mounting Type
Surface Mount
Package / Case
DSO-8
Configuration
Single Quad Drain Triple Source
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
20 m Ohms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 25 V
Continuous Drain Current
- 9.1 A
Power Dissipation
1.56 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
BSO200P03SNT
BSO200P03ST
SP000014959

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSO200P03S
Manufacturer:
INFINEON
Quantity:
5 510
Part Number:
BSO200P03S
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
BSO200P03S H
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
BSO200P03SH
Manufacturer:
CRYDOM
Quantity:
124
Part Number:
BSO200P03SH
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Rev. 1.21
1)
connection. PCB is vertical in still air.
Parameter
Thermal characteristics
Thermal resistance,
junction - soldering point
Thermal resistance,
junction - ambient
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Transconductance
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
j
=25 °C, unless otherwise specified
Symbol Conditions
R
R
V
V
I
I
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJS
thJA
DS(on)
minimal footprint,
t
minimal footprint,
steady state
6 cm
t
6 cm
steady state
V
V
I
V
T
V
T
V
V
|V
I
I
p
p
D
D
D
page 2
≤10 s
≤10 s
j
j
GS
DS
DS
DS
GS
GS
=-100 µA
=25 °C
=125 °C
=-7.3 A
DS
=-9.1 A
=V
=-30 V, V
=-30 V, V
=0 V, I
=-25 V, V
=-10 V,
|>2|I
2
2
cooling area
cooling area
GS
,
D
2
|R
D
(one layer, 70 µm thick) copper area for drain
=-250µA
DS(on)max
GS
GS
DS
=0 V,
=0 V,
=0 V
1)
1)
,
,
,
min.
-30
11
-1
-
-
-
-
-
-
-
-
-
Values
16.7
typ.
-1.5
-0.1
-10
-10
21
-
-
-
-
-
-
BSO200P03S
max.
-100
-100
20.0
110
150
35
53
80
-1
-
-
Unit
K/W
V
µA
nA
S
2008-04-22

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