MT48LC32M8A2TG-75:D Micron Technology Inc, MT48LC32M8A2TG-75:D Datasheet - Page 16
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MT48LC32M8A2TG-75:D
Manufacturer Part Number
MT48LC32M8A2TG-75:D
Description
DRAM Chip SDRAM 256M-Bit 32Mx8 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC32M8A2TG-75D.pdf
(87 pages)
Specifications of MT48LC32M8A2TG-75:D
Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx8
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Figure 8: 60-Ball FBGA "FB" (8mm x 16mm) (x4, x8)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60X Ø 0.45
8.00 ±0.05
5.60
Notes:
BALL
A8
0.155 ±0.013
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
16
SEATING PLANE
0.10 A
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
256Mb: x4, x8, x16 SDRAM
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID