MT48LC32M8A2TG-75:D Micron Technology Inc, MT48LC32M8A2TG-75:D Datasheet - Page 2
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MT48LC32M8A2TG-75:D
Manufacturer Part Number
MT48LC32M8A2TG-75:D
Description
DRAM Chip SDRAM 256M-Bit 32Mx8 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC32M8A2TG-75D.pdf
(87 pages)
Specifications of MT48LC32M8A2TG-75:D
Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx8
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Table 3: 256Mb SDR Part Numbering
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Note:
1. Actual FBGA part marking is shown in Package Dimensions (page 15).
MT48LC16M16A2BG
MT48LC16M16A2TG
MT48LC16M16A2FG
MT48LC64M4A2BB
MT48LC32M8A2BB
MT48LC64M4A2FB
MT48LC32M8A2FB
MT48LC64M4A2TG
MT48LC32M8A2TG
MT48LC16M16A2P
MT48LC64M4A2P
MT48LC32M8A2P
Part Numbers
1
1
1
1
Architecture
2
16 Meg x 16
16 Meg x 16
16 Meg x 16
16 Meg x 16
64 Meg x 4
64 Meg x 4
64 Meg x 4
64 Meg x 4
32 Meg x 8
32 Meg x 8
32 Meg x 8
32 Meg x 8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
60-ball FBGA
60-ball FBGA
60-ball FBGA
60-ball FBGA
54-ball FBGA
54-ball FBGA
Package
Features