HP1-TO3-CB CTS Thermal Management Products, HP1-TO3-CB Datasheet

HEATSINK PWR .90"H BLACK TO-3

HP1-TO3-CB

Manufacturer Part Number
HP1-TO3-CB
Description
HEATSINK PWR .90"H BLACK TO-3
Manufacturer
CTS Thermal Management Products
Series
HP1r
Datasheet

Specifications of HP1-TO3-CB

Package Cooled
TO-3
Attachment Method
Bolt On
Outline
63.50mm x 63.50mm
Height
0.9" (22.86mm)
Thermal Resistance @ Natural
5.4°C/W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Other names
294-1088
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
HP1 Series for Single TO-3 or Stud Mount Devices
Ordering Information
HP1-000-U
HP1-TO3-U
HP1-TO3-33U
HP1-TO3-44U
HP1-436-U
HP1-TO6-U
HP1-TO15-U
HP1-420-U
Unplated
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
Derate 1.0 °C/watt for unplated part in natural convection only.
HP1-000-CB
HP1-TO3-CB
HP1-TO3-33CB
HP1-TO3-44CB
HP1-436-CB
HP1-T06-CB
HP1-TO15-CB
HP1-420-CB
IERC PART NO.
Comm’l. Black
Anodize
HP1-000-B
HP1-TO3-B
HP1-TO3-33B
HP1-TO3-44B
HP1-436-B
HP1-T06-B
HP1-TO15-B
HP1-420-B
Mil. Black
Anodize
Undrilled
TO-3
TO-3 IC
TO-3 panel mount
TO-3 (4-pin)
TO-6, TO-36
TO-15, DO-5
Universal
Accommodated
Semiconductor
Technical
DESCRIPTION OF CURVES
A.
A.
B.
C.
E.
N.C. Horiz. Device
Only Mounted to G-10.
N.C. Horiz. & Vert.
With Dissipator.
200 RPM w/Diss.
500 RPM w/Diss.
1000 RPM w/Diss.
--
16
17
31
18
19
23
27
Hole patt.
Ref. No.
(see pg.
Series HP1
1-28)
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
Max. Weight
(Grams)

Related parts for HP1-TO3-CB

HP1-TO3-CB Summary of contents

Page 1

... Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-000-U HP1-000-CB HP1-TO3-U HP1-TO3-CB HP1-TO3-33U HP1-TO3-33CB HP1-TO3-44U HP1-TO3-44CB HP1-436-U HP1-436-CB HP1-TO6-U HP1-T06-CB HP1-TO15-U HP1-TO15-CB ...

Page 2

... HP1 Series for Single TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-TO66-U HP1-TO66-CB HP1-TO66-35U HP1-TO66-35CB HP1-TO66-49U HP1-TO66-49CB DESCRIPTION OF CURVES B ...

Page 3

... HP1 Series for Dual TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 2.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels. Ordering Information IERC PART NO. ...

Page 4

... HP1 Series for Three TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 3.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels in natural convection. Ordering Information IERC PART NO. ...

Page 5

... UP, UP1, UP2, HP1, and HP3 series heat dissipators. HOLE PATTERNS 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. ...

Page 6

... Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 25. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted) ...

Page 7

... CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 34. Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0- 66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators ...

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