HP1-TO3-CB CTS Thermal Management Products, HP1-TO3-CB Datasheet
HP1-TO3-CB
Specifications of HP1-TO3-CB
Related parts for HP1-TO3-CB
HP1-TO3-CB Summary of contents
Page 1
... Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-000-U HP1-000-CB HP1-TO3-U HP1-TO3-CB HP1-TO3-33U HP1-TO3-33CB HP1-TO3-44U HP1-TO3-44CB HP1-436-U HP1-436-CB HP1-TO6-U HP1-T06-CB HP1-TO15-U HP1-TO15-CB ...
Page 2
... HP1 Series for Single TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-TO66-U HP1-TO66-CB HP1-TO66-35U HP1-TO66-35CB HP1-TO66-49U HP1-TO66-49CB DESCRIPTION OF CURVES B ...
Page 3
... HP1 Series for Dual TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 2.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels. Ordering Information IERC PART NO. ...
Page 4
... HP1 Series for Three TO-66 Outline • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 3.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels in natural convection. Ordering Information IERC PART NO. ...
Page 5
... UP, UP1, UP2, HP1, and HP3 series heat dissipators. HOLE PATTERNS 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. ...
Page 6
... Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 25. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted) ...
Page 7
... CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 34. Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0- 66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators ...