HP1-TO3-CB CTS Thermal Management Products, HP1-TO3-CB Datasheet - Page 6

• Manufacturer Part Number: HP1-TO3-CB
• Description: HEATSINK PWR .90"H BLACK TO-3
• Manufacturer: CTS Thermal Management Products
• Series: HP1r

Specifications of HP1-TO3-CB

• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 63.50mm x 63.50mm
• Height: 0.9" (22.86mm)
• Thermal Resistance @ Natural: 5.4°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Other names: 294-1088

23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other
¼” stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
25. Hole pattern no. 199 accommodates TO-66 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.
24. Hole pattern no. 114 accommodates TO-66s. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
26. Hole pattern no. 226 accommodates TO-66 ICs (socket).
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
32. Hole pattern no. 150 accommodates two TO-66s. Available
in HP1 and HP3 series heat dissipators only.