MC33989PEG Freescale Semiconductor, MC33989PEG Datasheet - Page 65

• Manufacturer Part Number: MC33989PEG
• Description: SBC-HS
• Manufacturer: Freescale Semiconductor

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
INTRODUCTION
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
single heat source (P), a single junction temperature (T
(R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 36. Thermal Performance Comparison
Analog Integrated Circuit Device Data
Freescale Semiconductor
Notes:
θJA
This thermal addendum is provided as a supplement to the MC33989 technical
The MC33989 is offered in a 28 pin SOICW, single die package. There is a
The stated values are solely for a thermal performance comparison of one
1.
2.
3.
4.
5.
).
Per JEDEC JESD51-2 at natural convection, still air condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the package top surface; cold plate attached to the package
top surface and remaining surfaces insulated.
R
R
R
R
θJA
θJB
θJA
θJC
(1) (2)
(2) (3)
(1) (4)
(5)
Thermal Resistance
T
J
=
R
θJA
.
P
J
), and thermal resistance
[°C/W]
220
41
10
68
Note For package dimensions, refer to
the 33989 device datasheet.
EG SUFFIX (PB-FREE)
33989SOIC
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
28-PIN SOICW
98ASB42345B
SOICW
28-PIN
33989
65